Please refer to http://www.linear.com/designtools/packaging/
參數(shù)資料
型號: LT1128CS8#PBF
廠商: Linear Technology
文件頁數(shù): 15/28頁
文件大小: 0K
描述: IC OP-AMP LOW NOISE SNGL 8-SOIC
標準包裝: 100
放大器類型: 通用
電路數(shù): 1
轉換速率: 6 V/µs
增益帶寬積: 20MHz
電流 - 輸入偏壓: 30nA
電壓 - 輸入偏移: 20µV
電流 - 電源: 7.6mA
電壓 - 電源,單路/雙路(±): ±4 V ~ 18 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 8-SOIC(0.154",3.90mm 寬)
供應商設備封裝: 8-SO
包裝: 管件
產品目錄頁面: 1317 (CN2011-ZH PDF)
LT1028/LT1128
22
1028fb
package DescripTion
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
OBSOLETE PACKAGE
J8 0801
.014 – .026
(0.360 – 0.660)
.200
(5.080)
MAX
.015 – .060
(0.381 – 1.524)
.125
3.175
MIN
.100
(2.54)
BSC
.300 BSC
(7.62 BSC)
.008 – .018
(0.203 – 0.457)
0° – 15°
.005
(0.127)
MIN
.405
(10.287)
MAX
.220 – .310
(5.588 – 7.874)
1
2
3
4
8
7
6
5
.025
(0.635)
RAD TYP
.045 – .068
(1.143 – 1.650)
FULL LEAD
OPTION
.023 – .045
(0.584 – 1.143)
HALF LEAD
OPTION
CORNER LEADS OPTION
(4 PLCS)
.045 – .065
(1.143 – 1.651)
NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP/PLATE
OR TIN PLATE LEADS
J8 Package
3-Lead CERDIP (Narrow .300 Inch, Hermetic)
(Reference LTC DWG # 05-08-1110)
相關PDF資料
PDF描述
TSW-108-08-T-D CONN HEADER 16POS .100" DUAL TIN
TSW-115-07-L-S CONN HEADER 15POS .100" SGL GOLD
TSW-114-07-G-S CONN HEADER 14POS .100" SGL GOLD
LT1028CS8#PBF IC OP-AMP LOW NOISE SNGL 8-SOIC
TSW-108-05-G-S CONN HEADER 8POS .100" SGL GOLD
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