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參數(shù)資料
| 型號： | LT1126CS8#PBF |
| 廠商： | Linear Technology |
| 文件頁數(shù)： | 12/12頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC OP-AMP DECOMPENSAT DUAL 8SOIC |
| 標準包裝： | 100 |
| 放大器類型： | 通用 |
| 電路數(shù)： | 2 |
| 轉(zhuǎn)換速率： | 11 V/µs |
| 增益帶寬積： | 65MHz |
| 電流 - 輸入偏壓： | 8nA |
| 電壓 - 輸入偏移： | 25µV |
| 電流 - 電源： | 2.6mA |
| 電壓 - 電源，單路/雙路(±)： | ±4 V ~ 18 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 8-SOIC（0.154"，3.90mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 8-SO |
| 包裝： | 管件 |
| 產(chǎn)品目錄頁面： | 1317 (CN2011-ZH PDF) |
LT1126/LT1127
11267fa
9
PACKAGE DESCRIPTIO
U
N8 Package
8-Lead PDIP (Narrow .300 Inch)
(Reference LTC DWG # 05-08-1510)
N8 1002
.065
(1.651)
TYP
.045 – .065
(1.143 – 1.651)
.130
± .005
(3.302
± 0.127)
.020
(0.508)
MIN
.018
± .003
(0.457
± 0.076)
.120
(3.048)
MIN
12
3
4
87
6
5
.255
± .015*
(6.477
± 0.381)
.400*
(10.160)
MAX
.008 – .015
(0.203 – 0.381)
.300 – .325
(7.620 – 8.255)
.325
+.035
–.015
+0.889
–0.381
8.255
()
NOTE:
1. DIMENSIONS ARE
INCHES
MILLIMETERS
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010 INCH (0.254mm)
.100
(2.54)
BSC
S8 Package
8-Lead Plastic Small Outline (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1610)
J Package
14-Lead CERDIP (Narrow .300 Inch, Hermetic)
(Reference LTC DWG # 05-08-1110)
.016 – .050
(0.406 – 1.270)
.010 – .020
(0.254 – 0.508)
× 45°
0
°– 8° TYP
.008 – .010
(0.203 – 0.254)
SO8 0303
.053 – .069
(1.346 – 1.752)
.014 – .019
(0.355 – 0.483)
TYP
.004 – .010
(0.101 – 0.254)
.050
(1.270)
BSC
1
2
3
4
.150 – .157
(3.810 – 3.988)
NOTE 3
8
7
6
5
.189 – .197
(4.801 – 5.004)
NOTE 3
.228 – .244
(5.791 – 6.197)
.245
MIN
.160
±.005
RECOMMENDED SOLDER PAD LAYOUT
.045
±.005
.050 BSC
.030
±.005
TYP
INCHES
(MILLIMETERS)
NOTE:
1. DIMENSIONS IN
2. DRAWING NOT TO SCALE
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)
OBSOLETE PACKAGE
J14 0801
.045 – .065
(1.143 – 1.651)
.100
(2.54)
BSC
.014 – .026
(0.360 – 0.660)
.200
(5.080)
MAX
.015 – .060
(0.381 – 1.524)
.125
(3.175)
MIN
.300 BSC
(7.62 BSC)
.008 – .018
(0.203 – 0.457)
0
° – 15°
1
23
4
56
7
.220 – .310
(5.588 – 7.874)
.785
(19.939)
MAX
.005
(0.127)
MIN
14
11
8
9
10
13
12
.025
(0.635)
RAD TYP
NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP/PLATE
OR TIN PLATE LEADS
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