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參數(shù)資料
| 型號： | LSM-1.8/10-D12 |
| 元件分類： | 電源模塊 |
| 英文描述： | 1-OUTPUT DC-DC REG PWR SUPPLY MODULE |
| 封裝： | SMT-6 |
| 文件頁數(shù)： | 4/13頁 |
| 文件大?。?/td> | 660K |
| 代理商： | LSM-1.8/10-D12 |
LSM-10A D12 Series
N O N - I S O L A T E D , 8 - 5 0 W S M T D C / D C C O N V E R T E R S
12
Tape & Reel Surface Mount Package
DATEL's LSM series DC/DC converters are the only higher-current (10A)
SMT DC/DC's that can be automatically "pick-and-placed" using standard
vacuum-pickup equipment (nozzle size and style, vacuum pressure and
placement speed may need to be optimized for automated pick and place)
and subsequently reowed using high-temperature, lead-free solder.
Virtually all SMT DC/DC's today are unprotected "open-frame" devices
assembled by their vendors with high-temperature solder (usually
Sn96.5/Ag3.5 with a melting point +221°C) so that you may attach them
to your board using low-temperature solder (usually Sn63/Pb37 with a melt-
ing point of +183°C). Conceptually straightforward, this "stepped" solder
approach has its limitations, and it is clearly out of step with an industry
trending toward the broad use of lead-free solders. Are you to experiment
and develop reow proles from other vendors that ensure the components
on those DC/DC never exceed 215-216°C? If those components get too hot,
"double-reow" could compromise the reliability of their solder joints. Virtually
all these devices demand you "cool down" the Sn63 prole you are likely
using today.
Figure 6. Reow Solder Prole
DATEL is not exempted from the Laws of Physics, and we do not have
magic solders no one else has. Nevertheless, we have a simple and practical,
straightforward approach that works. We assemble our LSM SMT DC/DC's
using a high-temperature (+216°C), lead-free alloy (Sn96.2%, Ag2.5%,
Cu0.8%, Sb0.5%). The LSM design ensures co-planarity to within 0.004
inches (1001m) of the unit's tin-plated (150 micro-inches) copper leads. See
Mechanical Data for additional information.
The disposable heat shield (patent pending), which has a cutaway exposing
the package leads, provides thermal insulation to internal components during
reow and its smooth surface ideally doubles as the vacuum pick-up location
also. The insulation properties of the heat shield are so effective that tem-
perature differentials as high as 50°C develop inside-to-outside the shield.
Oven temperature proles with peaks of 250-260°C and dwell times exceed-
ing 2 minutes above 221°C (the melting point of Sn96.5/Ag3.5) are easily
achieved.
HEAT SHIELD OUTSIDE TEMPERATURE
Sn96.5/Ag3.5 Melting Point
Sn63/Pb37 Melting Point
250
200
150
100
50
0
50
100
150
200
250
300
350
400
221
183
PCB TEMPERATURE INSIDE THE HEAT SHIELD
Te
mperature
(
C)
Time (Seconds)
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