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參數(shù)資料
| 型號(hào)： | LPC3250FET296,551 |
| 廠商： | NXP Semiconductors |
| 文件頁(yè)數(shù)： | 18/57頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | IC ARM9 MCU 256K 296-TFBGA |
| 特色產(chǎn)品： | LPC32x0 ARM926EJ-S Processor |
| 標(biāo)準(zhǔn)包裝： | 126 |
| 系列： | LPC3200 |
| 核心處理器： | ARM9 |
| 芯體尺寸： | 16/32-位 |
| 速度： | 266MHz |
| 連通性： | EBI/EMI，以太網(wǎng)，I²C，IrDA，Microwire，SPI，SSI，SSP，UART/USART，USB OTG |
| 外圍設(shè)備： | DMA，I²S，LCD，電機(jī)控制 PWM，PWM，WDT |
| 輸入/輸出數(shù)： | 51 |
| 程序存儲(chǔ)器類型： | ROMless |
| RAM 容量： | 256K x 8 |
| 電壓 - 電源 (Vcc/Vdd)： | 0.9 V ~ 3.6 V |
| 數(shù)據(jù)轉(zhuǎn)換器： | A/D 3x10b |
| 振蕩器型： | 內(nèi)部 |
| 工作溫度： | -40°C ~ 85°C |
| 封裝/外殼： | 296-TFBGA |
| 包裝： | 托盤 |
| 配用： | 568-4743-ND - KIT LCD TOUCH 5.7" FOR LPC3250 568-4742-ND - MODULE DIMM LPC2478 ARM7 622-1030-ND - KIT LCD TOUCH 5.7" FOR LPC3250 |
| 其它名稱： | 568-4533 935287084551 |
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LPC3220_30_40_50
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 20 October 2011
25 of 79
NXP Semiconductors
LPC3220/30/40/50
16/32-bit ARM microcontrollers
7.1.3.2
Embedded trace buffer
The Embedded Trace Module (ETM) is connected directly to the ARM core. It compresses
the trace information and exports it through a narrow trace port. An internal Embedded
Trace Buffer (ETB) of 2048
24 bits captures the trace information under software
debugger control. Data from the ETB is recovered by the debug software through the
JTAG port.
The trace contains information about when the ARM core switches between states.
Instruction shows the flow of execution of the processor and provides a list of all the
instructions that were executed. Instruction trace is significantly compressed by only
broadcasting branch addresses as well as a set of status signals that indicate the pipeline
status on a cycle by cycle basis. For data accesses either data or address or both can be
traced.
7.2 AHB matrix
The LPC3220/30/40/50 has a multi-layer AHB matrix for inter-block communication. AHB
is an ARM defined high-speed bus, which is part of the ARM bus architecture. AHB is a
high-bandwidth low-latency bus that supports multi-master arbitration and a bus
grant/request mechanism. For systems that have only one (CPU), or two (CPU and DMA)
bus masters a simple AHB works well. However, if a system requires multiple bus masters
and the CPU needs access to external memory, a single AHB bus can cause a bottleneck.
To increase performance, the LPC3220/30/40/50 uses an expanded AHB architecture
known as Multi-layer AHB. A Multi-layer AHB replaces the request/grant and arbitration
mechanism used in a simple AHB with an interconnect matrix that moves arbitration out
toward the slave devices. Thus, if a CPU and a DMA controller want access to the same
memory, the interconnect matrix arbitrates between the two when granting access to the
memory. This advanced architecture allows simultaneous access by bus masters to
different resources with an increase in arbitration complexity. In this architectural
implementation, removing guaranteed central arbitration and allowing more than one bus
master to be active at the same time provides better overall microcontroller performance.
In the LPC3220/30/40/50, the multi-Layer AHB system has a separate bus for each of
seven AHB Masters:
CPU data bus
CPU instruction bus
General purpose DMA Master 0
General purpose DMA Master 1
Ethernet controller
USB controller
LCD controller
There are no arbitration delays unless two masters attempt to access the same slave at
the same time.
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