參數(shù)資料
型號(hào): LPC2294JBD144,551
廠商: NXP Semiconductors
文件頁(yè)數(shù): 44/54頁(yè)
文件大?。?/td> 0K
描述: IC ARM7 MCU FLASH 256K 144-LQFP
標(biāo)準(zhǔn)包裝: 60
系列: LPC2200
核心處理器: ARM7
芯體尺寸: 16/32-位
速度: 60MHz
連通性: CAN,EBI/EMI,I²C,Microwire,SPI,SSI,SSP,UART/USART
外圍設(shè)備: POR,PWM,WDT
輸入/輸出數(shù): 112
程序存儲(chǔ)器容量: 256KB(256K x 8)
程序存儲(chǔ)器類(lèi)型: 閃存
RAM 容量: 16K x 8
電壓 - 電源 (Vcc/Vdd): 1.65 V ~ 3.6 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 8x10b
振蕩器型: 內(nèi)部
工作溫度: -40°C ~ 105°C
封裝/外殼: 144-LQFP
包裝: 托盤(pán)
配用: OM10091-ND - KIT DEV PHYCORE-ARM7/LPC2220
568-1757-ND - BOARD EVAL FOR LPC220X ARM MCU
其它名稱(chēng): 568-1898
935275728551
LPC2294JBD144-S
LPC2292_2294
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 8 — 8 June 2011
49 of 54
NXP Semiconductors
LPC2292/2294
16/32-bit ARM microcontrollers with external memory interface
Fig 26. Package outline SOT569-2 (TFBGA144)
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
SOT569-2
SOT569-2
UNIT
mm
max
nom
min
1.20
1.05
0.95
0.40
0.35
0.30
0.50
0.45
0.40
12.1
12.0
11.9
12.1
12.0
11.9
0.8
9.6
0.15
0.1
A
DIMENSIONS (mm are the original dimensions)
TFBGA144: plastic thin fine-pitch ball grid array package; 144 balls
0
5
10 mm
scale
A1
A2
0.80
0.70
0.65
b
D
E
e
e1
9.6
e2
v
w
0.05
y
y1
0.08
C
y
C
y1
X
A
B
C
D
E
F
H
K
G
L
J
M
N
2468
10
12
13579
11
13
b
e2
e1
e
A
C
B
v M
C
w M
ball A1
index area
B
A
ball A1
index area
D
E
detail X
A
A2
A1
08-01-29
08-03-14
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