參數(shù)資料
型號(hào): LPC2292FBD144/01,5
廠商: NXP Semiconductors
文件頁(yè)數(shù): 22/54頁(yè)
文件大?。?/td> 0K
描述: IC ARM7 MCU FLASH 256K 144-LQFP
標(biāo)準(zhǔn)包裝: 60
系列: LPC2200
核心處理器: ARM7
芯體尺寸: 16/32-位
速度: 60MHz
連通性: CAN,EBI/EMI,I²C,Microwire,SPI,SSI,SSP,UART/USART
外圍設(shè)備: POR,PWM,WDT
輸入/輸出數(shù): 112
程序存儲(chǔ)器容量: 256KB(256K x 8)
程序存儲(chǔ)器類型: 閃存
RAM 容量: 16K x 8
電壓 - 電源 (Vcc/Vdd): 1.65 V ~ 3.6 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 8x10b
振蕩器型: 內(nèi)部
工作溫度: -40°C ~ 85°C
封裝/外殼: 144-LQFP
包裝: 托盤
產(chǎn)品目錄頁(yè)面: 704 (CN2011-ZH PDF)
配用: OM10091-ND - KIT DEV PHYCORE-ARM7/LPC2220
622-1005-ND - USB IN-CIRCUIT PROG ARM7 LPC2K
568-1757-ND - BOARD EVAL FOR LPC220X ARM MCU
其它名稱: 568-4319
935284895551
LPC2292FBD144/01-S
LPC2292FBD144/01-S-ND
LPC2292_2294
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 8 — 8 June 2011
29 of 54
NXP Semiconductors
LPC2292/2294
16/32-bit ARM microcontrollers with external memory interface
7.
Limiting values
[1]
The following applies to Table 6:
a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated
maximum.
b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSS unless
otherwise noted.
[2]
Internal rail.
[3]
External rail.
[4]
Including voltage on outputs in 3-state mode.
[5]
Only valid when the VDD(3V3) supply voltage is present.
[6]
Not to exceed 4.6 V.
[7]
Per supply pin.
[8]
The peak current is limited to 25 times the corresponding maximum current.
[9]
Per ground pin.
[10] Dependent on package type.
[11] Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k
series resistor.
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).[1]
Symbol
Parameter
Conditions
Min
Max
Unit
VDD(1V8)
supply voltage (1.8 V)
0.5
+2.5
V
VDD(3V3)
supply voltage (3.3 V)
0.5
+3.6
V
VDDA(3V3)
analog supply voltage (3.3 V)
0.5
+4.6
V
VIA
analog input voltage
0.5
+5.1
V
VI
input voltage
5 V tolerant I/O pins
0.5
+6.0
V
other I/O pins
0.5
VDD(3V3) + 0.5
V
IDD
supply current
100
mA
ISS
ground current
100
mA
Tj
junction temperature
-
150
C
Tstg
storage temperature
65
+150
C
Ptot(pack)
total power dissipation (per
package)
based on package heat
transfer, not device
power consumption
-1.5
W
Vesd
electrostatic discharge voltage
human body model
all pins
2000
+2000
V
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