參數(shù)資料
型號(hào): LPC1347FHN33,551
廠商: NXP Semiconductors
文件頁(yè)數(shù): 23/77頁(yè)
文件大?。?/td> 0K
描述: IC MCU 32BIT 64KB FLASH 33HVQFN
標(biāo)準(zhǔn)包裝: 260
系列: LPC13xx
核心處理器: ARM? Cortex?-M3
芯體尺寸: 32-位
速度: 72MHz
連通性: I²C,Microwire,SPI,SSI,SSP,UART/USART,USB
外圍設(shè)備: 欠壓檢測(cè)/復(fù)位,POR,WDT
輸入/輸出數(shù): 26
程序存儲(chǔ)器容量: 64KB(64K x 8)
程序存儲(chǔ)器類型: 閃存
EEPROM 大?。?/td> 4K x 8
RAM 容量: 12K x 8
電壓 - 電源 (Vcc/Vdd): 2 V ~ 3.6 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 8x12b
振蕩器型: 內(nèi)部
工作溫度: -40°C ~ 85°C
封裝/外殼: 32-VQFN 裸露焊盤
包裝: 托盤
其它名稱: 568-9600
LPC1315_16_17_45_46_47
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 3 — 20 September 2012
3 of 77
NXP Semiconductors
LPC1315/16/17/45/46/47
32-bit ARM Cortex-M3 microcontroller
Processor wake-up from Deep-sleep and Power-down modes via reset, selectable
GPIO pins, watchdog interrupt, or USB port activity.
Processor wake-up from Deep power-down mode using one special function pin.
Integrated PMU (Power Management Unit) to minimize power consumption during
Sleep, Deep-sleep, Power-down, and Deep power-down modes.
Power-On Reset (POR).
Brownout detect with up to four separate thresholds for interrupt and forced reset.
Unique device serial number for identification.
Single 3.3 V power supply (2.0 V to 3.6 V).
Temperature range
40 C to +85 C.
Available as LQFP64, LQFP48, and HVQFN33 package.
3.
Applications
4.
Ordering information
Consumer peripherals
Handheld scanners
Medical
USB audio devices
Industrial control
Table 1.
Ordering information
Type number
Package
Name
Description
Version
LPC1345FHN33
HVQFN33
plastic thermal enhanced very thin quad flat package; no leads; 33 terminals;
body 7
7 0.85 mm
n/a
LPC1345FBD48
LQFP48
plastic low profile quad flat package; 48 leads; body 7
7 1.4 mm
SOT313-2
LPC1346FHN33
HVQFN33
plastic thermal enhanced very thin quad flat package; no leads; 33 terminals;
body 7
7 0.85 mm
n/a
LPC1346FBD48
LQFP48
plastic low profile quad flat package; 48 leads; body 7
7 1.4 mm
SOT313-2
LPC1347FHN33
HVQFN33
plastic thermal enhanced very thin quad flat package; no leads; 33 terminals;
body 7
7 0.85 mm
n/a
LPC1347FBD48
LQFP48
plastic low profile quad flat package; 48 leads; body 7
7 1.4 mm
SOT313-2
LPC1347FBD64
LQFP64
LQFP64: plastic low profile quad flat package; 64 leads; body 10
10
1.4 mm
SOT314-2
LPC1315FHN33
HVQFN33
plastic thermal enhanced very thin quad flat package; no leads; 33 terminals;
body 7
7 0.85 mm
n/a
LPC1315FBD48
LQFP48
plastic low profile quad flat package; 48 leads; body 7
7 1.4 mm
SOT313-2
LPC1316FHN33
HVQFN33
plastic thermal enhanced very thin quad flat package; no leads; 33 terminals;
body 7
7 0.85 mm
n/a
LPC1316FBD48
LQFP48
plastic low profile quad flat package; 48 leads; body 7
7 1.4 mm
SOT313-2
LPC1317FHN33
HVQFN33
plastic thermal enhanced very thin quad flat package; no leads; 33 terminals;
body 7
7 0.85 mm
n/a
LPC1317FBD48
LQFP48
plastic low profile quad flat package; 48 leads; body 7
7 1.4 mm
SOT313-2
LPC1317FBD64
LQFP64
LQFP64: plastic low profile quad flat package; 64 leads; body 10
10
1.4 mm
SOT314-2
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