參數資料
型號: LPC1225FBD48/321,1
廠商: NXP Semiconductors
文件頁數: 24/61頁
文件大?。?/td> 0K
描述: MCU 32BIT 80K FLASH 8K 48-LQFP
產品培訓模塊: LPC1200 Series for Industrial Control
特色產品: LPC122x Cortex-M0 Microcontrollers
標準包裝: 250
系列: LPC1200
核心處理器: ARM? Cortex?-M0
芯體尺寸: 32-位
速度: 45MHz
連通性: I²C,IrDA,Microwire,SPI,SSI,SSP,UART/USART
外圍設備: 欠壓檢測/復位,DMA,POR,WDT
輸入/輸出數: 39
程序存儲器容量: 80KB(80K x 8)
程序存儲器類型: 閃存
RAM 容量: 8K x 8
電壓 - 電源 (Vcc/Vdd): 3 V ~ 3.6 V
數據轉換器: A/D 8x10b
振蕩器型: 內部
工作溫度: -40°C ~ 85°C
封裝/外殼: 48-LQFP
包裝: 托盤
其它名稱: 568-5158
LPC1225FBD48/321
LPC122X
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 26 August 2011
30 of 61
NXP Semiconductors
LPC122x
32-bit ARM Cortex-M0 microcontroller
9.
Thermal characteristics
9.1 Thermal characteristics
The average chip junction temperature, Tj (C), can be calculated using the following
equation:
(1)
Tamb = ambient temperature (C),
Rth(j-a) = the package junction-to-ambient thermal resistance (C/W)
PD = sum of internal and I/O power dissipation
The internal power dissipation is the product of IDD and VDD. The I/O power dissipation of
the I/O pins is often small and many times can be negligible. However it can be significant
in some applications.
T
j
T
amb
P
D
R
th j
a
+
=
Table 6.
Thermal characteristics
VDD = 3.0 V to 3.6 V; Tamb = 40 C to +85 C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Rth(j-a)
thermal resistance from
junction to ambient
JEDEC test board; no
air flow
LQFP64 package
-
61
-
C/W
LQFP48 package
86
-
C/W
Rth(j-c)
thermal resistance from
junction to case
JEDEC test board
LQFP64 package
-
19
-
C/W
LQFP48 package
36
-
C/W
Tj(max)
maximum junction
temperature
--150
C
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