Transient Characteristics
Symbol
Parameter
Conditions
Typ
Limit
Units
Min
Max
Δ
V
OUT
Dynamic Line Transient
Response V
IN
Dynamic Line Transient
Response V
BATT
Dynamic Load Transient
Response
Startup Time
V
IN
= V
OUT(NOM)
+ 0.3V to
V
OUT(NOM)
+ 0.9V; tr, tf = 10μs
V
BATT
= V
OUT(NOM)
+ 1.5V to
V
OUT(NOM)
+ 2.1V; tr, tf = 10μs
Pulsed load 0 ...300mA,
di/dt = 300mA/1μs
EN to 0.95 * V
OUT
±1
mV
Δ
V
OUT
±15
mV
Δ
V
OUT
±15
mV
T
STARTUP
70
150
μs
Input and Output Capacitors, Recommended Specification
Symbol
Parameter
Conditions
Nom
Limit
Units
Min
1.5
3
Max
10
300
C
OUT
Output Capacitance
Capacitance (Note 12)
ESR
2.2
μF
m
C
VIN
Input Capacitance at V
IN
Capacitance (Note 12), not needed in typ
post regulation application,
see FIGURE 1
ESR
1
0.47
μF
3
300
m
Note 1:
Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation
of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions,
see the Electrical Characteristics tables.
Note 2:
All voltages are with respect to the potential at the GND pin.
Note 3:
Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at T
J
= 165°C (typ.) and disengages at T
J
= 145°C (typ.).
Note 4:
For detailed soldering specifications and information, please refer to National Semiconductor Application Note 1112: Micro SMD Wafer Level Chip Scale
Package (AN-1112).
Note 5:
The Human body model is a 100pF capacitor discharged through a 1.5k
resistor into each pin. The machine model is a 200pF capacitor discharged
directly into each pin. (MIL-STD-883 3015.7)
Note 6:
In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be
derated. Maximum ambient temperature (T
A-MAX
) is dependent on the maximum operating junction temperature (T
= 125°C), the maximum power
dissipation of the device in the application (P
), and the junction-to ambient thermal resistance of the part/package in the application (
θ
JA
), as given by the
following equation: T
A-MAX
= T
J-MAX-OP
– (θ
JA
× P
D-MAX
).
Note 7:
Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power dissipation exists,
special attention must be paid to thermal dissipation issues in board design.
Note 8:
Min and Max limits are guaranteed by design, test, or statistical analysis. Typical (Typ) numbers are not guaranteed, but do represent the most likely
norm. Unless otherwise specified, conditions for Typ specifications are: V
IN
= V
OUT(NOM)
+ 1.0V, V
BATT
= V
OUT(NOM)
+ 1.5V or 2.5V, whichever is higher, T
A
= 25°
C.
Note 9:
Dropout voltage is defined as the input to output voltage differential at which the output voltage falls to 100mV below the nominal output voltage.
Note 10:
This specification does not apply for output voltages below 1.0V (as V
BATTMIN
= 2.5V).
Note 11:
V
OUT(NOM)
is the stated output voltage option
Note 12:
The capacitor tolerance should be 30% or better over temperature. The full operating conditions for the application should be considered when selecting
a suitable capacitor to ensure that the minimum value of capacitance is always met. Recommended capacitor type is X7R. However, dependent on application,
X5R, Y5V, and Z5U can also be used. The shown minimum limit represents real minimum capacitance, including all tolerances and must be maintained over
temperature and dc bias voltage (See capacitor section in Applications Hints)
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