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參數(shù)資料
| 型號： | LOG114AIRGVRG4 |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 模擬運算功能 |
| 英文描述： | LOG OR ANTILOG AMPLIFIER, PQCC16 |
| 封裝： | 4 X 4 MM, GREEN, PLASTIC, QFN-16 |
| 文件頁數(shù)： | 15/29頁 |
| 文件大?。?/td> | 637K |
| 代理商： | LOG114AIRGVRG4 |
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LOG114
SBOS301A MAY 2004 REVISED MARCH 2007
www.ti.com
22
For example, in a system configured for measurement
of five decades, with I1 = 1mA, and I2 = 10A:
V
LOGOUT IDEAL + 0.375
log
10*3
10*5
+ 0.75V
V
LOGOUT TYP + 0.375(1 " 0.004)
log
103
*5
1012
105
*5
1012
" 2(0.001)(5) " 0.011
Using the positive error components (+
K, +2Nm, and
+VOSO) to calculate the maximum typical output:
V
LOGOUT TYP + 0.774V
Therefore, the error in percent is:
%error
+
|0.75
*0.774|
0.75
100%
+ 3.2%
QFN PACKAGE
The LOG114 comes in a QFN-16 package. This lead-
less package has lead contacts on all four sides of the
bottom of the package, thereby maximizing board
space. An exposed leadframe die pad on the bottom of
the package enhances thermal and electrical charac-
teristics.
QFN packages are physically small, have a smaller
routing area, improved thermal performance, and im-
proved electrical parasitics. Additionally, the absence of
external leads eliminates bent-lead issues.
The QFN package can be easily mounted using stan-
dard printed circuit board (PCB) assembly techniques.
See Application Note QFN/SON PCB Attachment
(SLUA271) and Application Report Quad Flatpack No
Lead Logic Packages (SCBA017), both available for
download at www.ti.com.
The exposed leadframe die pad on the bottom of
the package should be connected to V.
QFN LAYOUT GUIDELINES
The exposed leadframe die pad on the QFN package
should be soldered to a thermal pad on the PCB. A me-
chanical drawing showing an example layout is at-
tached at the end of this data sheet. Refinements to this
layout may be necessary based on assembly process
requirements. Mechanical drawings located at the end
of this data sheet list the physical dimensions for the
package and pad. The five holes in the landing pattern
are optional, and are intended for use with thermal vias
that connect the leadframe die pad to the heatsink area
on the PCB.
Soldering the exposed pad significantly improves
board-level reliability during temperature cycling, key
push, package shear, and similar board-level tests.
Even with applications that have low-power dissipation,
the exposed pad must be soldered to the PCB to pro-
vide structural integrity and long-term reliability.
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| LOG114AIRGVT | 功能描述:對數(shù)放大器 Precision High-Speed RoHS:否 制造商:Texas Instruments 通道數(shù)量:3 帶寬:3 dB 共模抑制比（最小值）: 輸入補償電壓:+/- 7 mV 輸入電壓范圍（最大值）:5.5 V 工作電源電壓:4.5 V to 5.5 V 電源電流:+/- 15 mA 工作溫度范圍:- 40 C to +85 C 安裝風格:SMD/SMT 封裝 / 箱體:VQFN-16 封裝:Reel |
| LOG114AIRGVTG4 | 功能描述:對數(shù)放大器 Prec High-Speed Logarithmic Amp RoHS:否 制造商:Texas Instruments 通道數(shù)量:3 帶寬:3 dB 共模抑制比（最小值）: 輸入補償電壓:+/- 7 mV 輸入電壓范圍（最大值）:5.5 V 工作電源電壓:4.5 V to 5.5 V 電源電流:+/- 15 mA 工作溫度范圍:- 40 C to +85 C 安裝風格:SMD/SMT 封裝 / 箱體:VQFN-16 封裝:Reel |
| LOG114EVM | 功能描述:放大器 IC 開發(fā)工具 LOG114 Eval Mod RoHS:否 制造商:International Rectifier 產品:Demonstration Boards 類型:Power Amplifiers 工具用于評估:IR4302 工作電源電壓:13 V to 23 V |
| LOG1527 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:由CMOS工藝設計制造的可內燒的學習碼編碼IC. |
| LOG2112 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:LOGARITHMIC AND LOG RATIO AMPLIFIERS |
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