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參數(shù)資料
| 型號： | LMX9838 |
| 廠商： | National Semiconductor Corporation |
| 英文描述： | Bluetooth Serial Port Module |
| 中文描述： | 藍牙串行端口模塊 |
| 文件頁數(shù)： | 23/26頁 |
| 文件大小： | 974K |
| 代理商： | LMX9838 |
18.0 Soldering
The LMX9838 bumps are designed to melt as part of the Sur-
face Mount Assembly (SMA) process. In order to ensure
reflow of all solder bumps and maximum solder joint reliability
while minimizing damage to the package, recommended re-
flow profiles should be used.
Table 31
,
Table 32
and
Figure 13
provide the soldering details
required to properly solder the LMX9838 to standard PCBs.
The illustration serves only as a guide and National is not li-
able if a selected profile does not work.
See IPC/JEDEC J-STD-020C, July 2004 for more informa-
tion.
TABLE 31. Soldering Details
Parameter
Value
13 mil
19 mil
PCB Land Pad Diameter
PCB Solder Mask Opening
PCB Finish (HASL details)
Stencil Aperture
Stencil Thickness
Solder Paste Used
Flux Cleaning Process
Reflow Profiles
Defined by customer or manufacturing facility
17 mil
5 mil
Defined by customer or manufacturing facility
Defined by customer or manufacturing facility
See
Figure 13
TABLE 32. Classification Reflow Profiles
(Note 25)
,
(Note 26)
Profile Feature
NOPB Assembly
3°C/second maximum
150°C
200°C
60 – 180 seconds
Average Ramp-Up Rate (Ts
MAX
to Tp)
Preheat:
Temperature Min (Ts
MIN
)
Temperature Max (Ts
MAX
)
Time (ts
MIN
to ts
MAX
)
Time maintained above:
Temperature (T
L
)
Time (
tL
)
Peak/Classification Temperature (Tp)
Time within 5°C of actual Peak Temperature (tp)
Ramp-Down Rate
Time 25 °C to Peak Temperature
Reflow Profiles
217°C
60 – 150 seconds
250 + 0°C
20 – 40 seconds
6°C/second maximum
8 minutes maximum
See
Figure 13
Note 25:
See IPC/JEDEC J-STD-020C, July 2004.
Note 26:
All temperatures refer to the top side of the package, measured on the package body surface.
30027912
FIGURE 13. Typical Reflow Profiles
23
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相關PDF資料 |
PDF描述 |
|---|---|
| LMX9838SB | Bluetooth Serial Port Module |
| LMX9838SBX | Bluetooth Serial Port Module |
| LNBEH21 | LNB SUPPLY AND CONTROL IC WITH STEP-UP CONVERTER AND IC INTERFACE |
| LNBEH21PD | LNB SUPPLY AND CONTROL IC WITH STEP-UP CONVERTER AND IC INTERFACE |
| LNBEH21PD-TR | LNB SUPPLY AND CONTROL IC WITH STEP-UP CONVERTER AND IC INTERFACE |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| LMX9838_0709 | 制造商:NSC 制造商全稱:National Semiconductor 功能描述:Bluetooth㈢ Serial Port Module |
| LMX9838DONGLE | 功能描述:藍牙/802.15.1 模塊 RoHS:否 制造商:Murata Wireless Solutions 類:1 頻帶:2402 MHz to 2480 MHz 靈敏度:- 92 dBm 數(shù)據(jù)速率: 工作電源電壓:2.2 V to 3.3 V 輸出功率: 接口類型:PCM, UART 天線連接器類型:Chip 最大工作溫度:+ 85 C 尺寸:17.5 mm x 16 mm x 2 mm |
| LMX9838DONGLE/NOPB | 功能描述:藍牙/802.15.1 模塊 RoHS:否 制造商:Murata Wireless Solutions 類:1 頻帶:2402 MHz to 2480 MHz 靈敏度:- 92 dBm 數(shù)據(jù)速率: 工作電源電壓:2.2 V to 3.3 V 輸出功率: 接口類型:PCM, UART 天線連接器類型:Chip 最大工作溫度:+ 85 C 尺寸:17.5 mm x 16 mm x 2 mm |
| LMX9838SB | 制造商:Texas Instruments 功能描述:Bluetooth Class II 3.3V 0.704Mbps 70-Pin LTCC Tray |
| LMX9838SB/NOPB | 功能描述:藍牙/802.15.1 模塊 RoHS:否 制造商:Murata Wireless Solutions 類:1 頻帶:2402 MHz to 2480 MHz 靈敏度:- 92 dBm 數(shù)據(jù)速率: 工作電源電壓:2.2 V to 3.3 V 輸出功率: 接口類型:PCM, UART 天線連接器類型:Chip 最大工作溫度:+ 85 C 尺寸:17.5 mm x 16 mm x 2 mm |
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