參數(shù)資料
型號(hào)： LMX9820ASMX
廠(chǎng)商： NATIONAL SEMICONDUCTOR CORP
元件分類(lèi)： 通信及網(wǎng)絡(luò)
英文描述： Bluetooth Serial Port Module
中文描述： SPECIALTY TELECOM CIRCUIT, PBGA116
封裝： 10.10 X 14.10 MM, 2 MM HEIGHT, LGA-116
文件頁(yè)數(shù)： 39/44頁(yè)
文件大?。?/td> 579K
代理商： LMX9820ASMX
Revision 1.0
39
www.national.com
L
15.0 Soldering
(Continued)
15.0 Soldering
The LMX9820A bumps are designed to melt as part of the
Surface Mount Assembly (SMA) process. The LMX9820A
is assembled with a high-temperature solder alloy to
ensure there are no re-reflow conditions imposed upon the
module when reflowed to a PCB with these typical low tem-
perature 60/40 (S = 183°C, L = 188°C), 62/36/2 (E =
179°C), or 63/37 (E = 183°C) solder alloys.
Where:
S: Solidus
– Denotes the points in a phase diagram representing
the temperature at which the solder composition be-
gins to melt during heating, or complete freezing dur-
ing cooling.
L: Liquidus
– Denotes the points in a phase diagram representing
the temperature at which the solder has molten com-
ponents. The temperature that melting starts at.
E: Eutectic
– Denotes solid to liquid without a plastic phase.
The low-temperature solder alloy will reflow with the solder
bump and provide the maximum allowable solder-joint reli-
ability.
Reflow at a peak of 215 --> 220°C (approximately 30 sec-
onds at peak). Do not to exceed 220°C, measured in close
proximity of the modules. to avoid any potential re-reflow
conditions.
Table 41 and Figure 27 on page 40 provide the soldering
details required to properly solder the LMX9820A to stan-
dard PCBs. The illustration serves only as a guide and
National is not liable if a selected profile does not work.
Table 41. Soldering Details
Parameter
Value
PCB Land Pad Diameter
24 mil
PCB Solder Mask Opening
30 mil
PCB Finish (HASL details)
63/37 (difference in thickness < 28 micron)
Stencil Aperture
28 mil
Stencil Thickness
5 mil
Solder Paste Used
Low temperature 60/40 (S = 183°C, L = 188°C),
62/36/2 (E = 179°C),
or 63/37 (E = 183°C) solder alloys
1
Flux Cleaning Process
No Clean Flux System
1
Reflow Profiles
See Figure 27 on page 40
1.
Typically defined by customer.
相關(guān)PDF資料
PDF描述
LMX9820A Bluetooth Serial Port Module
LMX9820ASM Bluetooth Serial Port Module
LMX9820 Bluetooth Serial Port Module
LMX9820SB Bluetooth Serial Port Module
LMX9820SBX Bluetooth Serial Port Module
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
LMX9820ASMX/NOPB 制造商:Texas Instruments 功能描述:Bluetooth Class II 3.3V 0.704Mbps 116-Pin LTCC T/R 制造商:Texas Instruments 功能描述:MODULE BLUETOOTH SERIAL PORT SMD
LMX9820SB 制造商:Texas Instruments 功能描述: 制造商:Texas Instruments 功能描述:MODULE BLUE TOOTH 116-LTCC 制造商:Texas Instruments 功能描述:BLUETOOTH MODULE 2.4GHZ 704KBPS
LMX9820SBX 制造商:NSC 制造商全稱(chēng):National Semiconductor 功能描述:Bluetooth Serial Port Module
LMX9830 制造商:NSC 制造商全稱(chēng):National Semiconductor 功能描述:BluetoothTM Serial Port Module
LMX9830DONGLE 功能描述:藍(lán)牙/802.15.1 開(kāi)發(fā)工具 LMX9830 BLUETOOTH EVAL KIT RoHS:否 制造商:Panasonic Electronic Components 產(chǎn)品:Bluetooth Evaluation Kit 工具用于評(píng)估:PAN1721 頻率:2.4 GHz 接口類(lèi)型:I2C 工作電源電壓:2 V to 3.6 V
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