參數(shù)資料
型號(hào)： LMV822MMX/NOPB
廠(chǎng)商： National Semiconductor
文件頁(yè)數(shù)： 12/38頁(yè)
文件大小： 0K
描述： IC OP AMP R-R LOW VOLT LP 8-MSOP
標(biāo)準(zhǔn)包裝： 3,500
放大器類(lèi)型： 通用
電路數(shù)： 2
輸出類(lèi)型： 滿(mǎn)擺幅
轉(zhuǎn)換速率： 2 V/µs
增益帶寬積： 5.6MHz
電流 - 輸入偏壓： 100nA
電壓 - 輸入偏移： 3500µV
電流 - 電源： 500µA
電流 - 輸出 / 通道： 45mA
電壓 - 電源，單路/雙路(±)： 2.5 V ~ 5.5 V，±1.25 V ~ 2.75 V
工作溫度： -40°C ~ 85°C
安裝類(lèi)型： 表面貼裝
封裝/外殼： 8-TSSOP，8-MSOP（0.118"，3.00mm 寬）
供應(yīng)商設(shè)備封裝： 8-MSOP
包裝： 帶卷 (TR)
產(chǎn)品目錄頁(yè)面： 1269 (CN2011-ZH PDF)
其它名稱(chēng)： *LMV822MMX
*LMV822MMX/NOPB
LMV822MMX
LMV822MMXTR
SNOS032G – AUGUST 1999 – REVISED NOVEMBER 2013
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1) (2)
ESD Tolerance (3)
Machine Model
100V
Human Body Model
LMV822/824
2000V
LMV821
1500V
Differential Input Voltage
± Supply Voltage
Supply Voltage (V+–V )
5.5V
Output Short Circuit to V+(4)
Output Short Circuit to V(4)
Soldering Information
Infrared or Convection (20 sec)
235°C
Storage Temperature Range
65°C to 150°C
Junction Temperature (5)
150°C
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test
conditions, see the Electrical Characteristics.
(2)
If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(3)
Human body model, 1.5 k
in series wth 100 pF. Machine model, 200 in series with 100 pF.
(4)
Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C. Output currents in excess of 45 mA over long term may adversely
affect reliability.
(5)
The maximum power dissipation is a function of TJ(max) , θJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(max)–T A)/θJA. All numbers apply for packages soldered directly into a PC board.
Operating Ratings
(1)
Supply Voltage
2.5V to 5.5V
Temperature Range
LMV821, LMV822, LMV824
40°C ≤T J ≤85°C
LMV822-Q1, LMV824-Q1
40°C ≤T J ≤125°C
Thermal Resistance (
θ JA)
Ultra Tiny SC70-5 Package, 5-Pin Surface Mount
440 °C/W
Tiny SOT23-5 Package, 5-Pin Surface Mount
265 °C/W
SOIC Package, 8-Pin Surface Mount
190 °C/W
VSSOP Package, 8-Pin Mini Surface Mount
235 °C/W
SOIC Package, 14-Pin Surface Mount
145 °C/W
TSSOP Package, 14-Pin
155 °C/W
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test
conditions, see the Electrical Characteristics.
2
Copyright 1999–2013, Texas Instruments Incorporated
相關(guān)PDF資料
PDF描述
LMV822MM/NOPB IC OP AMP LO VOLTAGE/PWR 8-MSOP
PEC15SBEN CONN HEADER .100 SINGL R/A 15POS
SSW-117-02-S-D-RA CONN RCPT .100" 34PS DL R/A GOLD
SSW-122-01-G-D CONN RCPT .100" 44POS DUAL GOLD
SSQ-118-02-G-D CONN RCPT .100" 36POS DUAL GOLD
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