A
參數(shù)資料
型號(hào): LMV358DMR2G
廠商: ON Semiconductor
文件頁(yè)數(shù): 7/20頁(yè)
文件大小: 0K
描述: IC OP AMP DUAL LV R-R MICRO8
標(biāo)準(zhǔn)包裝: 4,000
放大器類型: 通用
電路數(shù): 2
輸出類型: 滿擺幅
轉(zhuǎn)換速率: 1 V/µs
增益帶寬積: 1MHz
電流 - 輸入偏壓: 1nA
電壓 - 輸入偏移: 1700µV
電流 - 電源: 210µA
電流 - 輸出 / 通道: 160mA
電壓 - 電源,單路/雙路(±): 2.7 V ~ 5.5 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 8-TSSOP,8-MSOP(0.118",3.00mm 寬)
供應(yīng)商設(shè)備封裝: Micro8?
包裝: 帶卷 (TR)
LMV321, LMV358, LMV324
http://onsemi.com
15
PACKAGE DIMENSIONS
Micro8
CASE 846A02
ISSUE H
S
B
M
0.08 (0.003)
A S
T
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED
0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. 846A-01 OBSOLETE, NEW STANDARD 846A-02.
b
e
PIN 1 ID
8 PL
0.038 (0.0015)
T
SEATING
PLANE
A
A1
c
L
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
8X
6X
mm
inches
SCALE 8:1
1.04
0.041
0.38
0.015
5.28
0.208
4.24
0.167
3.20
0.126
0.65
0.0256
DIM
A
MIN
NOM
MAX
MIN
MILLIMETERS
1.10
INCHES
A1
0.05
0.08
0.15
0.002
b
0.25
0.33
0.40
0.010
c
0.13
0.18
0.23
0.005
D
2.90
3.00
3.10
0.114
E
2.90
3.00
3.10
0.114
e
0.65 BSC
L
0.40
0.55
0.70
0.016
0.043
0.003
0.006
0.013
0.016
0.007
0.009
0.118
0.122
0.118
0.122
0.026 BSC
0.021
0.028
NOM
MAX
4.75
4.90
5.05
0.187
0.193
0.199
HE
HE
D
E
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