參數(shù)資料
型號(hào): LMV339
廠商: National Semiconductor Corporation
英文描述: General Purpose, Low Voltage, TinyPack Comparators
中文描述: 通用,低電壓,微封裝比較器
文件頁數(shù): 2/5頁
文件大?。?/td> 80K
代理商: LMV339
LMV331 SINGLE, LMV393 DUAL, LMV339 QUAD
GENERAL-PURPOSE LOW-VOLTAGE COMPARATORS
SLCS136C – AUGUST 1999 – REVISED APRIL 2000
2
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
AVAILABLE OPTIONS
TA
PACKAGE
TYPE
PACKAGED DEVICES
SINGLE
LMV331IDCKR
LMV331IDBVR
DUAL
QUADRUPLE
5-pin SOT
–40
°
C to 85
°
C
8-pin SOIC
8-pin TSSOP
LMV393ID
LMV393IPWR
14-pin SOIC
14-pin TSSOP
LMV339ID
LMV339IPWR
The D package is available taped and reeled. Add the suffix R to the device type (e.g.,
LMV393DR). The DCK, DBV, and PW packages are only available left-end taped and
reeled.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage, V
CC+
(see Note 1)
Differential input voltage, V
ID
(see Note 2)
Input voltage range, V
I
(either input)
Operating virtual junction temperature range
Package thermal impedance,
θ
JA
(see Notes 3 and 4): D (8-pin) package
5.5 V
±
5.5 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
0 to 5.5
°
C
0 to 150
°
C
97
°
C/W
86
°
C/W
347
°
C/W
389
°
C/W
149
°
C/W
113
°
C/W
260
°
C
–65 to 150
°
C
. . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . .
D (14-pin) package
DBV package
DCK package
PW (8-pin) package
PW (14-pin) package
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds: D or PW package
Storage temperature range, T
stg
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES:
1. All voltage values (except differential voltages and VCC+ specified for the measurement of IOS) are with respect to the network GND.
2. Differential voltages are at IN+ with respect to IN–.
3. Maximum power dissipation is a function of TJ(max),
θ
JA, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = (TJ(max) – TA)/
θ
JA. Selecting the maximum of 150
°
C can affect reliability.
4. The package thermal impedance is calculated in accordance with JESD 51.
recommended operating conditions
MIN
MAX
UNIT
VCC+
TA
Supply voltage (single-supply operation)
2.7
5.5
V
°
C
Operating free-air temperature
–40
85
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
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