(3) MSL, Peak Temp. - The Moisture Sensitivity L" />
參數(shù)資料
型號: LMH0002SQ/S250
廠商: National Semiconductor
文件頁數(shù): 12/13頁
文件大小: 0K
描述: IC CABLE DRIVER SDI 16-LLP
標準包裝: 1
類型: 串行驅動器
應用: SMPTE 259M / 344M
安裝類型: 表面貼裝
封裝/外殼: 16-WQFN 裸露焊盤
供應商設備封裝: 16-LLP
包裝: 標準包裝
產(chǎn)品目錄頁面: 1278 (CN2011-ZH PDF)
配用: SD002SQ-EVK-ND - BOARD EVALUATION LMH0002
其它名稱: LMH0002SQDKR
PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
Addendum-Page 2
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
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