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參數(shù)資料
| 型號(hào)： | LM90 |
| 廠商： | National Semiconductor Corporation |
| 元件分類： | 溫度/濕度傳感器 |
| 英文描述： | 3 Degree Celcious Accurate, Remote Diode and Local Digital Temperature Sensor with Two-Wire Interface |
| 中文描述： | 3度Celcious精確，遠(yuǎn)程二極管和本地?cái)?shù)字溫度傳感器兩線接口 |
| 文件頁(yè)數(shù)： | 16/20頁(yè) |
| 文件大?。?/td> | 384K |
| 代理商： | LM90 |
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2.0 LM90 REGISTERS
(Continued)
For RTOHB: Remote Temperature Offset High Byte. Power up default is LHIGH = RHIGH = 0C. 1LSB = 1C. Two’s complement
format.
(Read/Write Address 12h):
BIT
Value
D7
0.5
D6
0.25
D5
0.125
D4
0
D3
0
D2
0
D1
0
D0
0
For RTOLB: Remote Temperature Offset High Byte. Power up default is 0C. 1LSB = 0.125C. Two’s complement format.
The offset value written to these registers will automatically be added to or subtracted from the remote temperature measurement
that will be reported in the Remote Temperature registers.
2.9 LOCAL and REMOTE T_CRIT REGISTERS (RCS and LCS)
(Read/Write Address 20h, 19h):
BIT
Value
D7
SIGN
D6
64
D5
32
D4
16
D3
8
D2
4
D1
2
D0
1
D7–D0: T_CRIT setpoint temperature data. Power up default is T_CRIT = 85C. 1 LSB = 1C, two’s complement format.
2.10 T_CRIT HYSTERESIS REGISTER (TH)
(Read and Write Address 21h):
BIT
Value
D7
D6
D5
D4
16
D3
8
D2
4
D1
2
D0
1
D7–D0: T_CRIT Hysteresis temperature. Power up default is TH = 10C. 1 LSB = 1C, maximum value = 31.
2.11 FILTER and ALERT CONFIGURE REGISTER
(Read and Write Address BFh):
BIT
Value
D7
0
D6
0
D5
0
D4
0
D3
0
D2
Filter Level
D1
D0
ALERT
Configure
D7-D3: is not defined defaults to ’0’.
D2-D1: input filter setting as defined the table below:
D2
0
0
1
1
D1
0
1
0
1
Filter Level
No Filter
Level 1
Level 1
Level 2
Level 2 sets maximum filtering.
D0: when set to ’1’ comparator mode is enabled.
2.12 MANUFACTURERS ID REGISTER
(Read Address FEh) Default value 01h.
2.13 DIE REVISION CODE REGISTER
(Read Address FFh) Default value 21h. This register will increment by 1 every time there is a revision to the die by National
Semiconductor.
4.0 Application Hints
The LM90 can be applied easily in the same way as other
integrated-circuit temperature sensors, and its remote diode
sensing capability allows it to be used in new ways as well.
It can be soldered to a printed circuit board, and because the
path of best thermal conductivity is between the die and the
pins, its temperature will effectively be that of the printed
circuit board lands and traces soldered to the LM90’s pins.
This presumes that the ambient air temperature is almost the
same as the surface temperature of the printed circuit board;
if the air temperature is much higher or lower than the
surface temperature, the actual temperature of the of the
LM90 die will be at an intermediate temperature between the
surface and air temperatures. Again, the primary thermal
conduction path is through the leads, so the circuit board
temperature will contribute to the die temperature much
more strongly than will the air temperature.
To measure temperature external to the LM90’s die, use a
remote diode. This diode can be located on the die of a
target IC, allowing measurement of the IC’s temperature,
independent of the LM90’s temperature. The LM90 has been
optimized to measure the remote diode of a Pentium III
processor as shown in Figure 11 A discrete diode can also
L
www.national.com
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