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參數(shù)資料
| 型號(hào)： | LM77000CP |
| 廠商： | NATIONAL SEMICONDUCTOR CORP |
| 元件分類： | 運(yùn)動(dòng)控制電子 |
| 英文描述： | Power Operational Amplifiers |
| 中文描述： | OP-AMP, 3000 uV OFFSET-MAX, 1 MHz BAND WIDTH, PSFM4 |
| 文件頁數(shù)： | 6/14頁 |
| 文件大?。?/td> | 207K |
| 代理商： | LM77000CP |
Typ
i
JC
§
C/W
Max
i
JC
§
C/W
Typ
i
JA
§
C/W
Max
i
JA
§
C/W
Package
Plastic Package (P)
8.0
12
75
80
Metal Can (H)
30
40
120
150
P
D Max
e
T
J Max
b
T
A
i
JC
a
i
CA
e
T
J Max
b
T
A
or
i
JA
(without a heat sink)
i
CA
e
i
CS
a
i
SA
Solving T
J
:
T
J
e
T
A
a
P
D
(
i
JC
a
i
CA
) or
e
T
A
a
P
D
i
JA
(without a heat sink)
Where:
T
J
e
Junction Temperature
T
A
e
Ambient Temperature
P
D
e
Power Dissipation
i
JA
e
Junction to ambient thermal resistance
i
JC
e
Junction to case thermal resistance
i
CA
e
Case to ambient thermal resistance
i
CS
e
Case to heat sink thermal resistance
i
SA
e
Heat sink to ambient thermal resistance
Mounting Hints
Metal Can Package (LM759CH/LM759MH)
The LM759 in the 8-Lead TO-99 metal can package must
be used with a heat sink. With
g
15V power supplies, the
LM759 can dissipate up to 540 mW in its quiescent (no
load) state. This would result in a 100
§
C rise in chip temper-
ature to 125
§
C (assuming a 25
§
C ambient temperature). In
order to avoid this problem, it is advisable to use either a slip
on or stud mount heat sink with this package. If a stud
mount heat sink is used, it may be necessary to use insulat-
ing washers between the stud and the chassis because the
case of the LM759 is internally connected to the negative
power supply terminal.
Plastic Package (LM759CP/LM77000CP)
The LM759CP and LM77000CP are designed to be at-
tached by the tab to a heat sink. This heat sink can be either
one of the many heat sinks which are commercially avail-
able, a piece of metal such as the equipment chassis, or a
suitable amount of copper foil as on a double sided PC
board. The important thing to remember is that the negative
power supply connection to the op amp must be made
through the tab. Furthermore, adequate heat sinking must
be provided to keep the chip temperature below 125
§
C un-
der worst case load and ambient temperature conditions.
6
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