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參數(shù)資料
| 型號(hào)： | LM61 |
| 廠商： | National Semiconductor Corporation |
| 元件分類(lèi)： | 溫度/濕度傳感器 |
| 英文描述： | 2.7V, SOT-23 or TO-92 Temperature Sensor |
| 中文描述： | 為2.7V，采用SOT - 23或TO - 92溫度傳感器 |
| 文件頁(yè)數(shù)： | 5/9頁(yè) |
| 文件大小： | 242K |
| 代理商： | LM61 |
Typical Performance Characteristics
circuit board as shown in Figure 2 was used to generate the following thermal curves. (Continued)
The LM61 in the SOT-23 package mounted to a printed
1.0 Mounting
The LM61 can be applied easily in the same way as other
integrated-circuit temperature sensors. It can be glued or ce-
mented to a surface. The temperature that the LM61 is sens-
ing will be within about +0.2C of the surface temperature
that LM61’s leads are attached to.
This presumes that the ambient air temperature is almost the
same as the surface temperature; if the air temperature were
much higher or lower than the surface temperature, the ac-
tual temperature measured would be at an intermediate tem-
perature between the surface temperature and the air tem-
perature.
To ensure good thermal conductivity the backside of the
LM61 die is directly attached to the GND pin. The lands and
traces to the LM61 will, of course, be part of the printed cir-
cuit board, which is the object whose temperature is being
measured.
Alternatively, the LM61 can be mounted inside a sealed-end
metal tube, and can then be dipped into a bath or screwed
into a threaded hole in a tank. As with any IC, the LM61 and
accompanying wiring and circuits must be kept insulated and
dry, to avoid leakage and corrosion. This is especially true if
the circuit may operate at cold temperatures where conden-
sation can occur. Printed-circuit coatings and varnishes such
as Humiseal and epoxy paints or dips are often used to en-
sure that moisture cannot corrode the LM61 or its connec-
tions.
The thermal resistance junction to ambient (
θ
) is the pa-
rameter used to calculate the rise of a device junction tem-
perature due to its power dissipation. For the LM61 the
equation used to calculate the rise in the die temperature is
as follows:
T
J
= T
A
+
θ
JA
[(+V
S
I
Q
) + (+V
S
V
O
) I
L
]
where I
is the quiescent current and I
is the load current on
the output. Since the LM61’s junction temperature is the ac-
tual temperature being measured care should be taken to
minimize the load current that the LM61 is required to drive.
The table shown in Figure 3 summarizes the rise in die tem-
perature of the LM61 without any loading with a 3.3V supply,
and the thermal resistance for different conditions.
Supply Voltage
vs Supply Current
DS012897-12
Start-Up Response
DS012897-22
DS012897-14
FIGURE 2. Printed Circuit Board Used
for Heat Sink to Generate All Curves.
1
2
" Square Printed Circuit Board
with 2 oz. Copper Foil or Similar.
www.national.com
5
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PDF描述 |
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| LM61CIM3X | 2.7V, SOT-23 or TO-92 Temperature Sensor |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| LM61_05 | 制造商:NSC 制造商全稱(chēng):National Semiconductor 功能描述:2.7V, SOT-23 or TO-92 Temperature Sensor |
| LM61026 BL199 | 制造商:Belden Inc 功能描述:SHLD COMPOSITE CABLE 2TWINAX/26COND 20/16AWG, Composite Conductor Types:2 Twinax |
| LM6104 | 制造商:NSC 制造商全稱(chēng):National Semiconductor 功能描述:Quad Gray Scale Current Feedback Amplifier |
| LM6104M | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| LM611 | 制造商:SEOUL 制造商全稱(chēng):Seoul Semiconductor 功能描述:RED LAMP LED |
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