參數(shù)資料
型號(hào)： LM56
廠商： National Semiconductor Corporation
英文描述： Aluminum Electrolytic Capacitor; Capacitor Type:High Temperature; Voltage Rating:40VDC; Capacitor Dielectric Material:Aluminum Electrolytic; Operating Temperature Range:-55 C to +125 C; Capacitance:680uF RoHS Compliant: Yes
中文描述： 雙路輸出低功耗溫控器
文件頁(yè)數(shù)： 4/13頁(yè)
文件大小： 370K
代理商： LM56
LM56 Electrical Characteristics
The following specifications apply for V
+
= 2.7 V
, and V
load current = 50 μA unless otherwise specified.
Boldface lim-
its apply for T
A
= T
J
= T
MIN
to T
MAX
;
all other limits T
A
= T
J
= 25C unless otherwise specified.
Symbol
Parameter
Conditions
Typical
(Note 6)
Limits
(Note 7)
Units
(Limits)
V
+
Power Supply
I
S
Supply Current
V
+
= +10V
V
+
= +2.7V
230
230
μA (max)
μA (max)
Digital Outputs
I
OUT(“1”)
Logical “1” Output Leakage
Current
Logical “0” Output Voltage
V
+
= +5.0V
1
μA (max)
V
OUT(“0”)
I
OUT
= +50 μA
0.4
V (max)
Note 1:
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is func-
tional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed speci-
fications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions.
Note 2:
When the input voltage (V
I
) at any pin exceeds the power supply (V
I
<
GND or V
I
>
V
+
), the current at that pin should be limited to 5 mA. The 20 mA maxi-
mum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 5 mA to four.
Note 3:
The maximum power dissipation must be derated at elevated temperatures and is dictated by T
(maximum junction temperature),
θ
(junction to am-
bient thermal resistance) and T
(ambient temperature). The maximum allowable power dissipation at any temperature is P
= (T
–T
A
)/
θ
or the number given
in the Absolute Maximum Ratings, whichever is lower. For this device, T
Jmax
= 125C. For this device the typical thermal resistance (
θ
JA
) of the different package
types when board mounted follow:
Package Type
M08A
MUA08A
θ
JA
110C/W
250C/W
Note 4:
The human body model is a 100 pF capacitor discharge through a 1.5 k
resistor into each pin. The machine model is a 200 pF capacitor discharged directly
into each pin.
Note 5:
See AN450 “Surface Mounting Methods and Their Effects on Product Reliability” or the section titled “Surface Mount” found in any post 1986 National Semi-
conductor Linear Data Book for other methods of soldering surface mount devices.
Note 6:
Typicals are at T
J
= T
A
= 25C and represent most likely parametric norm.
Note 7:
Limits are guaranteed to National’s AOQL (Average Outgoing Quality Level).
L
www.national.com
4
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