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參數(shù)資料
| 型號(hào)： | LM4863N |
| 廠商： | NATIONAL SEMICONDUCTOR CORP |
| 元件分類： | 音頻／視頻放大 |
| 英文描述： | Dual 2.2W Audio Amplifier Plus Stereo Headphone Function |
| 中文描述： | 1.5 W, 2 CHANNEL, AUDIO AMPLIFIER, PDIP16 |
| 封裝： | 0.300 INCH, MDIP-16 |
| 文件頁(yè)數(shù)： | 5/16頁(yè) |
| 文件大?。?/td> | 513K |
| 代理商： | LM4863N |
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External Components Description
(Figure 1 )
Components
1.
R
i
Inverting input resistance which sets the closed-loop gain in conjunction with R
f
. This resistor also forms a
high pass filter with C
i
at f
c
= 1/(2
π
R
i
C
i
).
2.
C
i
Input coupling capacitor which blocks the DC voltage at the amplifier’s input terminals. Also creates a
highpass filter with R
i
at f
c
= 1/(2
π
R
i
C
i
). Refer to the section,
Proper Selection of External Components
,
for an explanation of how to determine the value of C
i
.
3.
R
f
Feedback resistance which sets the closed-loop gain in conjunction with R
i
.
4.
C
s
Supply bypass capacitor which provides power supply filtering. Refer to the
Power Supply Bypassing
section for information concerning proper placement and selection of the supply bypass capacitor.
5.
C
B
Bypass pin capacitor which provides half-supply filtering. Refer to the section,
Proper Selection of
External Components
, for information concerning proper placement and selection of C
B
.
Functional Description
Typical Performance Characteristics
MTE Specific Characteristics
Note 16:
These curves show the thermal dissipation ability of the LM4863MTE at different ambient temperatures given these conditions:
500LFPM + JEDEC board:
The part is soldered to a 1S2P 20-lead exposed-DAP TSSOP test board with 500 linear feet per minute of forced-air flow across
it.
Board information
- copper dimensions: 74x74mm, copper coverage: 100% (buried layer) and 12% (top/bottom layers), 16 vias under the exposed-DAP.
500LFPM + 2.5in
2
:
The part is soldered to a 2.5in
2
, 1 oz. copper plane with 500 linear feet per minute of forced-air flow across it.
2.5in
2
:
The part is soldered to a 2.5in
2
, 1oz. copper plane.
Not Attached:
The part is not soldered down and is not forced-air cooled.
LM4863MTE
THD+N vs Output Power
DS012881-97
LM4863MTE
THD+N vs Frequency
DS012881-99
LM4863MTE
THD+N vs Output Power
DS012881-96
LM4863MTE
THD+N vs Frequency
DS012881-98
LM4863MTE
Power Dissipation vs Power Output
DS012881-90
LM4863MTE
(Note 16)
Power Derating Curve
DS012881-95
L
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