參數(shù)資料
型號(hào): LM4510
廠商: National Semiconductor Corporation
英文描述: Synchronous Step-Up DC/DC Converter with True Shutdown Isolation
中文描述: 同步升壓型DC / DC轉(zhuǎn)換器,具有真關(guān)斷隔離
文件頁數(shù): 14/18頁
文件大?。?/td> 2362K
代理商: LM4510
TABLE 4. Suggested C
S
and Compensation Components
Model
Type
Vendor
Voltage Rating
Case Size
Inch (mm)
603 (1608)
(C
S
)
C1608C0G1E103J
(C
1
)
TMK107SD222JA-T
(R
C
)
9t06031A4642FBHFT
Ceramic, X5R
TDK
6.3V
Ceramic, X5R
Taiyo Yuden
25V
603 (1608)
Resistor
Yageo Corporation
1/10W
603 (1608)
LAYOUT CONSIDERATIONS AND THERMAL
MANAGEMENT
30031096
FIGURE 7. Evaluation Board Layout
High frequency switching regulators require very careful lay-
out of components in order to get stable operation and low
noise. All components must be as close as possible to the
LM4510 device. Refer to Figure 7 as an example. Some ad-
ditional guidelines to be observed:
1. C
IN
must be placed close to the device and connected di-
rectly from VIN to PGND pins. This reduces copper trace
resistance, which affects the input voltage ripple of the device.
For additional input voltage filtering, typically a 0.1 uF bypass
capacitor can be placed between VIN and AGND. This by-
pass capacitor should be placed near the device closer than
C
IN
.
2. C
must also be placed close to the device and connect-
ed directly from VOUT to PGND pins. Any copper trace
connections for the C
OUT
capacitor can increase the series
resistance, which directly affects output voltage ripple and
makes noise during output voltage sensing.
3. All voltage-sensing resistors (R
, R
) should be kept
close to the FB pin to minimize copper trace connections that
can inject noise into the system. The ground connection for
the voltage-sensing resistor should be connected directly to
the AGND pin.
4. Trace connections made to the inductor should be mini-
mized to reduce power dissipation, EMI radiation and in-
crease overall efficiency. Also poor trace connection increas-
es the ripple of SW.
5. C
, C
, C
, R
must be placed close to the device and
connected to AGND.
6. The AGND pin should connect directly to the ground. Not
connecting the AGND pin directly, as close to the chip as
possible, may affect the performance of the LM4510 and limit
its current driving capability. AGND and PGND should be
separate planes and should be connected at a single point.
7. For better thermal performance, DAP should be connected
to ground, but cannot be used as the primary ground con-
nection. The PC board land may be modified to a "dog bone"
shape to reduce LLP thermal impedance. For detail informa-
tion, refer to Application Note AN-1187.
FLASH/TORCH APPLICATION
LM4510 can be configured to drive white LEDs for the flash
and torch functions. The flash/torch can be set up with the
circuit shown in Figure 8 by using the resistor R
to determine
the current in Torch Mode and R
F
to determine the current in
Flash Mode. The amount of current can be estimated using
the following equations:
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