參數(shù)資料
型號: LM385BZ-2.5RE
廠商: ON SEMICONDUCTOR
元件分類: 基準(zhǔn)電壓源/電流源
英文描述: 1-OUTPUT TWO TERM VOLTAGE REFERENCE, 2.5 V, PBCY3
封裝: PLASTIC, TO-226AA, 3 PIN
文件頁數(shù): 30/44頁
文件大小: 921K
代理商: LM385BZ-2.5RE
13–25
MOTOROLA ANALOG IC DEVICE DATA
FTA SUFFIX
CASE 932–02
Plastic Package
(TQFP–48)
ISSUE D
DIM
A
MIN
MAX
MIN
MAX
INCHES
7.000 BSC
0.276 BSC
MILLIMETERS
A1
3.500 BSC
0.138 BSC
B
7.000 BSC
0.276 BSC
B1
3.500 BSC
0.138 BSC
C
1.400
1.600
0.055
0.063
D
0.170
0.270
0.007
0.011
E
1.350
1.450
0.053
0.057
F
0.170
0.230
0.007
0.009
G
0.500 BASIC
0.020 BASIC
H
0.050
0.150
0.002
0.006
J
0.090
0.200
0.004
0.008
K
0.500
0.700
0.020
0.028
M
12 REF
N
0.090
0.160
0.004
0.006
P
0.250 BASIC
0.010 BASIC
Q
1
5
1
5
R
0.150
0.250
0.006
0.010
S
9.000 BSC
0.354 BSC
S1
4.500 BSC
0.177 BSC
V
9.000 BSC
0.354 BSC
V1
4.500 BSC
0.177 BSC
W
0.200 REF
0.008 REF
X
1.000 REF
0.039 REF
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED
AT DATUM PLANE –AB–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –AC–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350 (0.014).
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER IS OPTIONAL.
__
_
A
A1
–T–
Z
0.200 (0.008) AB T–U
–U–
4X
Z
0.200 (0.008) AC T–U
4X
B
B1
1
12
13
24
25
36
37
48
–Z–
S1
S
V
V1
P
AE
–T–, –U–, –Z–
DETAIL Y
BASE METAL
N
J
F
D
S
T–U
M
0.080 (0.003)
Z S
AC
SECTION AE–AE
–AB–
–AC–
AD
G
0.080 (0.003) AC
M
_
TOP & BOTTOM
Q
_
W
K
X
E
C
H
0.250 (0.010)
GAUGE PLANE
R
9
DETAIL AD
48
1
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