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參數(shù)資料
| 型號： | LM3595 |
| 廠商： | National Semiconductor Corporation |
| 元件分類： | LED驅(qū)動器 |
| 英文描述： | The LM3595 is a parallel white-LED driver that is capable of driving four white LEDs. |
| 中文描述： | 該LM3595是平行的白光LED驅(qū)動器能夠驅(qū)動4個白光LED的能力。 |
| 文件頁數(shù)： | 4/11頁 |
| 文件大小： | 233K |
| 代理商： | LM3595 |
Electrical Characteristics
(Notes 2, 8)
(Continued)
Limits in standard typeface and typical values apply for T
= 25
o
C. Limits in
boldface
type apply over the operating junction
temperature range. Unless otherwise specified: V
IN
= 5V, V
OUTX
= 3.6V, R
SET
= 8.25k
, V(EN) = V
IN
, V(BR-ON) = 0V
Symbol
Parameter
Conditions
V(EN) = 1.5V
V(EN) = 0V
I
BR-ON
BR-ON Pin Current
0
≤
V
BR-ON
≤
V
IN
Min
Typ
1.5
0
0
Max
Units
I
EN
EN Pin Current (Note 9)
μA
μA
Note 1:
Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation
of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see
the Electrical Characteristics tables.
Note 2:
All voltages are with respect to the potential at the GND pin.
Note 3:
Thermal shutdown circuitry protects the device from permanent damage.
Note 4:
The Human body model is a 100pF capacitor discharged through a 1.5k
resistor into each pin. The machine model is a 200pF capacitor discharged
directly into each pin. MIL-STD-883 3015.7
Note 5:
The operation rating for minimum input voltage, V
MIN
, is limited by V
OUTX
and I
OUTX
as dictated by headroom voltage. The equation, V
MIN
≥
(V
OUTX
+V
HR
),
must be satisfied for the desired output current to be realized. For more information, see the section on Output Current Capability found in this datasheet.
Note 6:
In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be
derated. Maximum ambient temperature (T
A-MAX
) is dependent on the maximum operating junction temperature (T
J-MAX-OP
= 105C), the maximum power
dissipation of the device in the application (P
D-MAX
), and the junction-to ambient thermal resistance of the part/package in the application (
θ
JA
), as given by the
following equation: T
A-MAX
= T
J-MAX-OP
- (
θ
JA
D-MAX
).
Note 7:
Junction-to-ambient thermal resistance (
θ
) is taken from a thermal modeling result, performed under the conditions and guidelines set forth in the JEDEC
standard JESD51-7. The test board is a 4-layer FR-4 board measuring 102mm x 76mm x 1.6mm with a 2x1 array of thermal vias. The ground plane on the board
is 50mm x 50mm. Thickness of copper layers are 36μm/18μm/18μm/36μm (1.5oz/1oz/1oz/1.5oz). Ambient temperature in simulation is 22C, still air. Power
dissipation is 1W. The value of
θ
of the LM3595 in LLP-10 could fall in a range as wide as 50C/W to 150C/W (if not wider), depending on PWB material, layout,
and environmental conditions. In applications where high maximum power dissipation exists (high V
, high I
), special care must be paid to thermal dissipation
issues. For more information on these topics, please refer to Application Note 1187: Leadless Leadframe Package (LLP) and the Power Dissipation and PCB Layout
Considerations sections of this datasheet.
Note 8:
All room temperature limits are 100% tested or guaranteed through statistical analysis. All limits at temperature extremes are guaranteed by correlation
using standard Statistical Quality Control methods (SQC). All limits are used to calculate Average Outgoing Quality Level (AOQL). Typical numbers are not
guaranteed, but do represent the most likely norm.
Note 9:
The EN pin has an internally connected 1M
pull-down resistor
Block Diagram
20072203
L
www.national.com
4
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