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參數(shù)資料
| 型號： | LM3207TLX |
| 廠商： | NATIONAL SEMICONDUCTOR CORP |
| 元件分類： | 穩(wěn)壓器 |
| 英文描述： | 650mA Miniature, Adjustable, Step-Down DC-DC Converter for RF Power Amplifiers with Integrated Vref LDO |
| 中文描述： | 1.2 A SWITCHING REGULATOR, 2300 kHz SWITCHING FREQ-MAX, BGA9 |
| 封裝： | MICRO SMD, 9 PIN |
| 文件頁數(shù)： | 17/19頁 |
| 文件大小： | 1335K |
| 代理商： | LM3207TLX |
Application Information
(Continued)
wide, for a section approximately 6mil long or longer, to
provide thermal relief. Each trace should then neck up or
down to its optimal width. The important criterion is symme-
try. This ensures the solder bumps re-flow evenly and that
the device solders level to the board. In particular, special
attention must be paid to the pads for bumps A1, A3 and B3.
Because P
GND
and PV
IN
are typically connected to large
copper planes, inadequate thermal relief’s may result in late
or inadequate re-flow of these bumps. The Micro SMD pack-
age is optimized for the smallest possible size in applications
with red or infrared opaque cases. Because the Micro SMD
package lacks the plastic encapsulation characteristic of
larger devices, it is vulnerable to light. Backside metalization
and/or epoxy coating, along with front-side shading by the
printed circuit board, reduce this sensitivity. However, the
package has exposed die edges. Micro SMD devices are
sensitive to light, in the red and infrared range, shining on the
package’s exposed die edges.
BOARD LAYOUT CONSIDERATIONS
Referring to
Figure 4
, the LM3207 has two major current
loops where pulse and ripple current flow. The loop shown in
the left hand side is most important, because pulse current
shown in
Figure 4
flows in this path. The right hand side is
next. The current waveform in this path is triangular, as
shown in
Figure 4
. Pulse current has many high-frequency
components due to fast di/dt. Triangular ripple current also
has wide high-frequency components. Board layout and cir-
cuit pattern design of these two loops are the key factors for
reducing noise radiation and stable operation. Other lines,
such as from battery to C1(+) and C2(+) to load, are almost
DC current, so it is not necessary to take so much care. Only
pattern width (current capability) and DCR drop consider-
ations are needed.
20165354
FIGURE 4. Current Loop
L
www.national.com
17
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| LM3207TLX/NOPB | 功能描述:DC/DC 開關(guān)控制器 RoHS:否 制造商:Texas Instruments 輸入電壓:6 V to 100 V 開關(guān)頻率: 輸出電壓:1.215 V to 80 V 輸出電流:3.5 A 輸出端數(shù)量:1 最大工作溫度:+ 125 C 安裝風(fēng)格: 封裝 / 箱體:CPAK |
| LM3207TLX-2.53 | 制造商:NSC 制造商全稱:National Semiconductor 功能描述:650mA Miniature, Adjustable, Step-Down DC-DC Converter for RF Power Amplifiers with Integrated Vref LDO |
| LM3207TLX-2.53/NOPB | 功能描述:DC/DC 開關(guān)控制器 RoHS:否 制造商:Texas Instruments 輸入電壓:6 V to 100 V 開關(guān)頻率: 輸出電壓:1.215 V to 80 V 輸出電流:3.5 A 輸出端數(shù)量:1 最大工作溫度:+ 125 C 安裝風(fēng)格: 封裝 / 箱體:CPAK |
| LM3208 | 制造商:NSC 制造商全稱:National Semiconductor 功能描述:650mA Miniature, Adjustable, Step-Down DC-DC Converter for RF Power Amplifiers |
| LM3208TL | 制造商:Texas Instruments 功能描述:Conv DC-DC Single Step Down 2.7V to 5.5V 8-Pin uSMD T/R 制造商:Texas Instruments 功能描述:IC, BUCK, 650MA, RF PWR AMP, 8USMD |
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