參數(shù)資料
型號: LM3205TLX
廠商: NATIONAL SEMICONDUCTOR CORP
元件分類: 穩(wěn)壓器
英文描述: 650mA Miniature, Adjustable, Step-Down DC-DC Converter for RF Power Amplifiers
中文描述: 1.2 A SWITCHING REGULATOR, 2300 kHz SWITCHING FREQ-MAX, PBGA8
封裝: LEAD FREE, MICRO, SMD-8
文件頁數(shù): 11/18頁
文件大小: 1285K
代理商: LM3205TLX
Block Diagram
Operation Description
The LM3205 is a simple, step-down DC-DC converter opti-
mized for powering RF power amplifiers (PAs) in mobile
phones, portable communicators, and similar battery pow-
ered RF devices. It is designed to allow the RF PAto operate
at maximum efficiency over a wide range of power levels
from a single Li-Ion battery cell. It is based on a current-
mode buck architecture, with synchronous rectification for
high efficiency. It is designed for a maximum load capability
of 650mA in PWM mode.
Maximum load range may vary from this depending on input
voltage, output voltage and the inductor chosen.
Efficiency is typically around 96% for a 400mAload with 3.4V
output, 4.2V input. The output voltage is dynamically pro-
grammable from 0.8V (typ.) to 3.6V (typ.) by adjusting the
voltage on the control pin without the need for external
feedback resistors. This ensures longer battery life by being
able to change the PAsupply voltage dynamically depending
on its transmitting power.
Additional features include current overload protection and
thermal overload shutdown.
The LM3205 is constructed using a chip-scale 8-pin mi-
croSMD or 10-pin LLP package. These packages offers the
smallest possible size, for space-critical applications such as
cell phones, where board area is an important design con-
sideration. Use of a high switching frequency (2MHz) re-
duces the size of external components. As shown in
Figure
1
, only three external power components are required for
implementation. Use of a microSMD package requires spe-
cial design considerations for implementation. (See mi-
croSMD Package Assembly and use in the Applications
Information section.) Its fine bump-pitch requires careful
board design and precision assembly equipment. Use of this
package is best suited for opaque-case applications, where
its edges are not subject to high-intensity ambient red or
infrared light. Also, the system controller should set EN low
during power-up and other low supply voltage conditions.
(See Shutdown Mode in the Device Information section.)
20158035
FIGURE 2. Functional Block Diagram
L
www.national.com
11
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