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參數(shù)資料
| 型號(hào)： | LM285-1.2D |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | MICROPOWER VOLTAGE REFERENCES |
| 中文描述： | 微功耗電壓參考 |
| 文件頁數(shù)： | 8/15頁 |
| 文件大小： | 307K |
| 代理商： | LM285-1.2D |
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
SOIC
Package
Drawing
D
Pins Package
Qty
75
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
LM285D-1-2
ACTIVE
8
Pb-Free
(RoHS)
Pb-Free
(RoHS)
None
Pb-Free
(RoHS)
Pb-Free
(RoHS)
None
None
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
None
None
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
CU NIPDAU
Level-2-250C-1 YEAR
LM285DR-1-2
ACTIVE
SOIC
D
8
2500
CU NIPDAU
Level-2-250C-1 YEAR
LM285LP-1-2
LM385BD-1-2
ACTIVE
ACTIVE
TO-92
SOIC
LP
D
3
8
1000
75
Call TI
CU NIPDAU
Level-NC-NC-NC
Level-2-250C-1 YEAR
LM385BDR-1-2
ACTIVE
SOIC
D
8
2500
CU NIPDAU
Level-2-250C-1 YEAR
LM385BLP-1-2
LM385BLPR-1-2
LM385BPW-1-2
ACTIVE
ACTIVE
ACTIVE
TO-92
TO-92
TSSOP
LP
LP
PW
3
3
8
1000
2000
150
Call TI
Call TI
CU NIPDAU
Level-NC-NC-NC
Level-NC-NC-NC
Level-1-250C-UNLIM
LM385BPWR-1-2
ACTIVE
TSSOP
PW
8
2000
CU NIPDAU
Level-1-250C-UNLIM
LM385D-1-2
ACTIVE
SOIC
D
8
75
CU NIPDAU
Level-2-250C-1 YEAR
LM385DR-1-2
ACTIVE
SOIC
D
8
2500
CU NIPDAU
Level-2-250C-1 YEAR
LM385LP-1-2
LM385LPR-1-2
LM385PSR-1-2
ACTIVE
ACTIVE
ACTIVE
TO-92
TO-92
SO
LP
LP
PS
3
3
8
1000
2000
2000
Call TI
Call TI
CU NIPDAU
Level-NC-NC-NC
Level-NC-NC-NC
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Level-1-250C-UNLIM
LM385PW-1-2
ACTIVE
TSSOP
PW
8
150
CU NIPDAU
LM385PWR-1-2
ACTIVE
TSSOP
PW
8
2000
CU NIPDAU
Level-1-250C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check
for the latest availability information and additionalproduct content details.
None:
Not yet available Lead (Pb-Free).
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:
The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
PACKAGE OPTION ADDENDUM
www.ti.com
17-Feb-2005
Addendum-Page 1
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