參數(shù)資料
型號: LM2574HV
廠商: National Semiconductor Corporation
文件頁數(shù): 23/24頁
文件大?。?/td> 397K
代理商: LM2574HV
LM2574
23
MOTOROLA ANALOG IC DEVICE DATA
N SUFFIX
PLASTIC PACKAGE
CASE 626–05
(DIP–8)
ISSUE K
OUTLINE DIMENSIONS
NOTES:
1. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
2. PACKAGE CONTOUR OPTIONAL (ROUND OR
SQUARE CORNERS).
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
STYLE 1:
PIN 1. AC IN
2. DC + IN
3. DC – IN
4. AC IN
5. GROUND
6. OUTPUT
7. AUXILIARY
8. VCC
1
4
5
8
F
NOTE 2
–A–
–B–
–T–
SEATING
H
J
G
D
K
N
C
L
M
M
A
M
0.13 (0.005)
B
M
T
DIM
A
B
C
D
F
G
H
J
K
L
M
N
MIN
9.40
6.10
3.94
0.38
1.02
2.54 BSC
0.76
0.20
2.92
7.62 BSC
–––
0.76
MAX
10.16
6.60
4.45
0.51
1.78
MIN
0.370
0.240
0.155
0.015
0.040
0.100 BSC
0.030
0.008
0.115
0.300 BSC
–––
0.030
MAX
0.400
0.260
0.175
0.020
0.070
INCHES
MILLIMETERS
1.27
0.30
3.43
0.050
0.012
0.135
10
1.01
10
0.040
DW SUFFIX
PLASTIC PACKAGE
CASE 751G–03
(SO–16L)
ISSUE B
D
14X
B
16X
SEATING
PLANE
S
A
M
0.25
B
S
T
16
9
8
1
h
M
B
M
0
H
8
E
B
A
e
T
A
A
L
C
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INLCUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.
DIM
A
A1
B
C
D
E
e
H
h
L
MIN
2.35
0.10
0.35
0.23
10.15
7.40
MAX
2.65
0.25
0.49
0.32
10.45
7.60
MILLIMETERS
1.27 BSC
10.05
0.25
0.50
0
10.55
0.75
0.90
7
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