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參數(shù)資料
| 型號(hào)： | LK1AF-9V |
| 廠商： | Mitsubishi Electric Corporation |
| 英文描述： | SLIM POWER RELAY WITH HIGH INRUSH CURRENT CAPABILITY |
| 中文描述： | SLIM的功率繼電器，大浪涌電流能力 |
| 文件頁數(shù)： | 3/3頁 |
| 文件大小： | 49K |
| 代理商： | LK1AF-9V |
LK
61
6-1. Electrical life test
(5 A 277 V AC, resistive load)
Sample: LK1aF-12V, 6 pcs.
Operation frequency: 20 times/min.
(ON/OFF = 1.5s: 1.5s)
Ambient temperature: 26
°
C
79
°
F
Circuit:
Change of pick-up and drop-out voltage
Change of contact resistance
DC12V
Contact
AC277V
0
5
10
No. of operations,
×
10
4
R
0
20
40
60
80
100
Pick-up voltage
Drop-out voltage
Max.
Min.
Max.
Min.
0
5
10
No. of operations,
×
10
4
C
Max.
Min.
0
10
20
30
40
50
6-2. Electrical life test
(UL lamp load test TV-5)
Tested sample: LK1aF-12V, 6 pcs.
Overload test
Load: 7.5 A 120 V AC (60 Hz),
Inrush: 111 A
Operation frequency: 10 times/min
(ON: OFF = 1 s: 5 s)
No. of operations: 50 ope.
Endurance test
Load: 5A 120 V AC (60 Hz),
Inrush: 78 A
Operation frequency: 10 times/min
(ON: OFF = 1 s: 5 s)
No. of operations: 25,000 ope.
Change of pick-up and drop-out voltage
Change of contact resistance
No. of operations,
×
10
4
Max.
Min.
Max.
R
00
2.5
20
40
60
80
100
Pick-up voltage
Drop-out voltage
No. of operations,
×
10
4
Max.
00
2.5
10
20
30
40
50
C
NOTES
1. Cleaning
This relay is not the sealed type, so it can-
not be immersion cleaned. Be careful that
flux does not overflow onto the PC board
or penetrate inside the relay.
2. Soldering
We recommend the following soldering
conditions.
1) Automatic soldering
* Preheating: 100
°
C
212
(PC board solder surface)
* Soldering: 260
°
C
500
°
F
, within 2 mins
°
F
, within 5 s
2) Hand soldering
* Iron tip temperature: 280 to 300
to 571
°
F
* Soldering iron: 30 to 60W
* Soldering time: Within 3 s
°
C
536
For Cautions for Use, see Relay Technical Information (Page 11 to 39).
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