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參數(shù)資料
| 型號： | LH538700A |
| 廠商： | Sharp Corporation |
| 英文描述： | CMOS 8M (1M x 8) MROM |
| 中文描述： | 800萬的CMOS（100萬× 8）MROM |
| 文件頁數(shù)： | 1/6頁 |
| 文件大?。?/td> | 58K |
| 代理商： | LH538700A |
LH538700A
CMOS 8M (1M
×
8) MROM
FEATURES
1,048,576 words
×
8 bit organization
Access time: 100 ns (MAX.)
Power consumption:
Operating: 550 mW (MAX.)
Standby: 550
μ
W (MAX.)
Static operation
TTL compatible I/O
Three-state outputs
Single +5 V power supply
Packages:
32-pin, 600-mil DIP
32-pin, 525-mil SOP
32-pin, 400-mil TSOP (Type II)
DESCRIPTION
The LH538700A is an 8M-bit mask-programmable
ROM organized as 1,048,576
×
8 bits. It is fabricated
using silicon-gate CMOS process technology.
PIN CONNECTIONS
538700A-1
TOP VIEW
1
2
3
4
5
6
9
10
A
2
A
1
A
0
D
0
A
5
A
4
V
CC
A
18
A
17
28
27
26
25
24
23
20
17
A
7
A
6
7
8
A
3
22
21
A
15
A
12
GND
A
13
A
8
A
9
A
11
OE
A
10
CE
D
7
D
6
D
5
D
4
D
3
11
12
13
32
31
30
29
A
14
14
15
16
19
18
D
1
D
2
A
16
32-PIN DIP
32-PIN SOP
A
19
Figure 1. Pin Connections for DIP and
SOP Packages
538700A-2
TOP VIEW
2
3
4
5
8
9
A
4
A
3
A
7
A
6
A
5
29
28
27
26
25
24
21
18
A
15
A
12
6
7
23
22
A
14
A
13
A
8
D
4
D
3
10
11
12
31
30
A
2
A
1
A
0
D
0
D
1
D
2
13
20
19
32-PIN TSOP (Type II)
14
15
16
17
32
1
A
16
CE
A
18
A
17
A
9
A
11
OE
A
10
D
7
D
6
D
5
A
19
GND
NOTE:
Reverse bend available on request.
V
CC
Figure 2. Pin Connections for TSOP Package
PRELIMINARY
1
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| LH538700AD | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x8 ROM (Mask Programmable) |
| LH538700AN | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x8 ROM (Mask Programmable) |
| LH538700AS | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x8 ROM (Mask Programmable) |
| LH538700ASR | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x8 ROM (Mask Programmable) |
| LH538P00BD | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x8 or x16 ROM (Mask Programmable) |
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