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參數(shù)資料
| 型號： | LC245A |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | OCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS |
| 中文描述： | 八路總線收發(fā)器具有三態(tài)輸出 |
| 文件頁數(shù)： | 8/19頁 |
| 文件大小： | 585K |
| 代理商： | LC245A |
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
SSOP
SSOP
Package
Drawing
DB
DB
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
SN74LVC245ADBLE
SN74LVC245ADBR
OBSOLETE
ACTIVE
20
20
None
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
None
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Green (RoHS &
no Sb/Br)
None
2000 Green (RoHS &
no Sb/Br)
250
Pb-Free
(RoHS)
1000 Green (RoHS &
no Sb/Br)
1000
Pb-Free
(RoHS)
Call TI
CU NIPDAU
Call TI
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Level-1-250C-UNLIM
2000
SN74LVC245ADGVR
ACTIVE
TVSOP
DGV
20
2000
CU NIPDAU
SN74LVC245ADW
ACTIVE
SOIC
DW
20
25
CU NIPDAU
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
Level-1-240C-UNLIM
Level-NC-NC-NC
SN74LVC245ADWR
ACTIVE
SOIC
DW
20
2000
CU NIPDAU
SN74LVC245AGQNR
SN74LVC245AN
ACTIVE
ACTIVE
VFBGA
PDIP
GQN
N
20
20
1000
20
SNPB
CU NIPDAU
SN74LVC245ANSR
ACTIVE
SO
NS
20
2000
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Level-1-260C-UNLIM
SN74LVC245APW
ACTIVE
TSSOP
PW
20
70
CU NIPDAU
SN74LVC245APWLE
SN74LVC245APWR
OBSOLETE
ACTIVE
TSSOP
TSSOP
PW
PW
20
20
Call TI
CU NIPDAU
Call TI
Level-1-260C-UNLIM
SN74LVC245APWT
ACTIVE
TSSOP
PW
20
CU NIPDAU
Level-1-250C-UNLIM
SN74LVC245ARGYR
ACTIVE
QFN
RGY
20
CU NIPDAU
Level-2-260C-1YEAR
SN74LVC245AZQNR
ACTIVE
VFBGA
ZQN
20
SNAGCU
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check
http://www.ti.com/productcontent
for the latest availability information and additional
product content details.
None:
Not yet available Lead (Pb-Free).
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:
The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
PACKAGE OPTION ADDENDUM
www.ti.com
28-Feb-2005
Addendum-Page 1
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