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參數(shù)資料
| 型號(hào)： | LC0402FC12C-T75-1 |
| 廠商： | PROTEK DEVICES |
| 元件分類： | 參考電壓二極管 |
| 英文描述： | 200 W, BIDIRECTIONAL, SILICON, TVS DIODE |
| 封裝： | FLIP CHIP-4 |
| 文件頁數(shù)： | 6/9頁 |
| 文件大?。?/td> | 626K |
| 代理商： | LC0402FC12C-T75-1 |
Only One Name Means ProTek’Tion
www.protekdevices.com
05139.R8 2/11
Page 6
0
LC0402FC3.3C - LC0402FC36C
sOLDER REFLOW INFORMATION
PRINTED CIRCuIT BOARD RECOMMENDATIONs
PARAMETER
vALuE
Pad Size on PCB
0.275mm
Pad Shape
Round
Pad Definition
Non-Solder Mask Defined Pads
Solder Mask Opening
0.325mm Round
Solder Stencil Thickness
0.150mm
Solder Stencil Aperture Opening (Laser cut, 5% tapered walls)
0.330mm Round
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance - Edge To Corner Ball
±50μm
Solder Ball Side Coplanarity
±20μm
Maximum Dwell Time Above Liquidous (183°C)
60 seconds
Soldering Maximum Temperature
270°C
T
P
30-60 seconds
Ramp-up
15 seconds
(Minimize)
solder-Time
15-20 seconds
Ramp-Down
Ramp-Down
solder Melt
(Maximum Temp)
Maximum solder Reflow
(35-53°C Above Maximum solder Melt Temp)
Ramp-up
Preheat
(stay Below Flux Activation Temp)
T
RECOMMENDED NON-sOLDER MAsK
DEFINED PAD ILLusTRATION
Non-solder Mask Defined Pad
0.275mm DIA.
solder Mask Opening
0.325mm DIA.
solder stencil Opening
0.330mm DIA.
REquIREMENTs
Temperature:
Preheat time and temperature depends on solder paste and flux activa-
tion temperature, component size, weight, surface area and plating.
T
P
for Lead-Free (Sn/Ag/Cu): 260-270°C
T
for Tin-Lead: 240-245°C
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| LC0402FC15C | 制造商:PROTEC 制造商全稱:Protek Devices 功能描述:200W LOW CAPACITANCE flip chip tvs array |
| LC0402FC24C | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Direct ProTek Replacement:LC0402FC24C |
| LC0402FC3.3C | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Direct ProTek Replacement:LC0402FC3.3C |
| LC0402FC3.3C_12 | 制造商:PROTEC 制造商全稱:Protek Devices 功能描述:200W LOW CAPACITANCE FLIP CHIP TVS ARRAY |
| LC0402FC36C | 制造商:PROTEC 制造商全稱:Protek Devices 功能描述:200W LOW CAPACITANCE flip chip tvs array |
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