參數(shù)資料
型號(hào): LBG6SP
廠商: Osram Opto Semiconductors GmbH
英文描述: Advanced Power TOPLED Enhanced optical Power LED
中文描述: 高級(jí)電源TOPLED增強(qiáng)光功率LED
文件頁(yè)數(shù): 13/17頁(yè)
文件大?。?/td> 265K
代理商: LBG6SP
LB G6SP, LT G6SP
2007-08-08
13
Ltbedingungen
Soldering Conditions
Vorbehandlung nach JEDEC Level 2
Preconditioning acc. to JEDEC Level 2
IR-Reflow Ltprofil für bleifreies Lten
IR Reflow Soldering Profile for lead free soldering
(nach J-STD-020B)
(acc. to J-STD-020B)
Wellenlten (TTW)
9)
Seite 17
TTW Soldering
9) page 17
(nach CECC 00802)
(acc. to CECC 00802)
OHLA0687
0
0
T
t
C
s
120 s max
50
100
150
200
250
300
Ramp Up
3 K/s (max)
100 s max
50
100
150
200
250
300
Ramp Down
6 K/s (max)
25 C
30 s max
260 C
+0 C
245 C
±5 C
235 C
-0 C
-5 C
240 C
255 C
217 C
Maximum Solder Profile
Recommended Solder Profile
Minimum Solder Profile
+5 C
10 s min
OHLY0598
0
0
50
100
150
200
250
50
100
150
200
250
300
T
t
C
s
235 C
10 s
C
... 260
1. Welle
1. wave
2. Welle
2. wave
5 K/s
2 K/s
ca 200 K/s
C
C
... 130
100
2 K/s
Zwangskühlung
forced cooling
Normalkurve
standard curve
Grenzkurven
limit curves
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