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參數(shù)資料
| 型號： | L6226N |
| 廠商： | 意法半導(dǎo)體 |
| 英文描述： | DMOS DUAL FULL BRIDGE DRIVER |
| 中文描述： | 偶的DMOS全橋驅(qū)動(dòng)器 |
| 文件頁數(shù)： | 17/22頁 |
| 文件大小： | 404K |
| 代理商： | L6226N |
17/22
L6226
OUTPUT CURRENT CAPABILITY AND IC POWER DISSIPATION
In Fig. 16 and Fig. 17 are shown the approximate relation between the output current and the IC power dissipa-
tion using PWM current control driving two loads, for two different driving types:
– One Full Bridge ON at a time (Fig.16) in which only one load at a time is energized.
– Two Full Bridges ON at the same time (Fig.17) in which two loads at the same time are energized.
For a given output current and driving type the power dissipated by the IC can be easily evaluated, in order to
establish which package should be used and how large must be the on-board copper dissipating area to guar-
antee a safe operating junction temperature (125°C maximum).
Figure 16. IC Power Dissipation versus Output Current with One Full Bridge ON at a time.
Figure 17. IC Power Dissipation versus Output Current with Two Full Bridges ON at the same time.
THERMAL MANAGEMENT
In most applications the power dissipation in the IC is the main factor that sets the maximum current that can be de-
liver by the device in a safe operating condition. Therefore, it has to be taken into account very carefully. Besides the
available space on the PCB, the right package should be chosen considering the power dissipation. Heat sinking can
be achieved using copper on the PCB with proper area and thickness. Figures 19, 20 and 21 show the Junction-to-
Ambient Thermal Resistance values for the PowerSO36, PowerDIP24 and SO24 packages.
For instance, using a PowerSO package with copper slug soldered on a 1.5 mm copper thickness FR4 board
with 6cm
2
dissipating footprint (copper thickness of 35μm), the R
th j-amb
is about 35°C/W. Fig. 18 shows mount-
ing methods for this package. Using a multi-layer board with vias to a ground plane, thermal impedance can be
reduced down to 15°C/W.
No PWM
f
SW
= 30 kHz (slow decay)
Test Conditions:
Supply Voltage = 24V
I
A
I
B
I
OUT
I
OUT
ONE FULL BRIDGE ON AT A TIME
P
D
[W]
I
OUT
[A]
0
0.25 0.5 0.75 1
1.25 1.5
0
2
4
6
8
10
No PWM
f
SW
= 30 kHz (slow decay)
Test Conditions:
Supply Voltage =24 V
I
A
I
B
I
OUT
I
OUT
P
D
[W]
I
OUT
[A]
TWO FULL BRIDGES ON AT THE SAME TIME
10
0
0.25 0.5 0.75 1
1.25 1.5
0
2
4
6
8
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| L6226PD | DMOS DUAL FULL BRIDGE DRIVER |
| L6228 | DMOS DRIVER FOR BIPOLAR STEPPER MOTOR |
| L6228D | DMOS DRIVER FOR BIPOLAR STEPPER MOTOR |
| L6228N | DMOS DRIVER FOR BIPOLAR STEPPER MOTOR |
| L6228PD | DMOS DRIVER FOR BIPOLAR STEPPER MOTOR |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| L6226PD | 功能描述:馬達(dá)/運(yùn)動(dòng)/點(diǎn)火控制器和驅(qū)動(dòng)器 Dual Full Bridge RoHS:否 制造商:STMicroelectronics 產(chǎn)品:Stepper Motor Controllers / Drivers 類型:2 Phase Stepper Motor Driver 工作電源電壓:8 V to 45 V 電源電流:0.5 mA 工作溫度:- 25 C to + 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HTSSOP-28 封裝:Tube |
| L6226PDTR | 功能描述:馬達(dá)/運(yùn)動(dòng)/點(diǎn)火控制器和驅(qū)動(dòng)器 Dual Full Bridge RoHS:否 制造商:STMicroelectronics 產(chǎn)品:Stepper Motor Controllers / Drivers 類型:2 Phase Stepper Motor Driver 工作電源電壓:8 V to 45 V 電源電流:0.5 mA 工作溫度:- 25 C to + 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HTSSOP-28 封裝:Tube |
| L6226Q | 功能描述:功率驅(qū)動(dòng)器IC DMOS Full Bridge Driver RoHS:否 制造商:Micrel 產(chǎn)品:MOSFET Gate Drivers 類型:Low Cost High or Low Side MOSFET Driver 上升時(shí)間: 下降時(shí)間: 電源電壓-最大:30 V 電源電壓-最小:2.75 V 電源電流: 最大功率耗散: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
| L6226Q_10 | 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:DMOS dual full bridge driver |
| L6226QTR | 功能描述:功率驅(qū)動(dòng)器IC DMOS Full Bridge Driver RoHS:否 制造商:Micrel 產(chǎn)品:MOSFET Gate Drivers 類型:Low Cost High or Low Side MOSFET Driver 上升時(shí)間: 下降時(shí)間: 電源電壓-最大:30 V 電源電壓-最小:2.75 V 電源電流: 最大功率耗散: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
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