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參數(shù)資料
| 型號(hào)： | L532 |
| 廠商： | IXYS Corporation |
| 英文描述： | IGBT phaseleg in ISOPLUS i4-PAC |
| 中文描述： | IGBT的phaseleg在ISOPLUS i4 - PAC的 |
| 文件頁(yè)數(shù)： | 2/2頁(yè) |
| 文件大?。?/td> | 47K |
| 代理商： | L532 |
2 - 2
2004 IXYS All rights reserved
FII 30-06D
IXYS reserves the right to change limits, test conditions and dimensions.
Dimensions in mm (1 mm = 0.0394")
Component
Symbol
Conditions
Maximum Ratings
T
VJ
T
stg
-55...+150
-55...+125
°
C
°
C
V
ISOL
I
ISOL
≤
1 mA; 50/60 Hz
2500
V~
F
C
mounting force with clip
20...120
N
Symbol
Conditions
Characteristic Values
min.
typ.
max.
C
P
coupling capacity between shorted
pins and mounting tab in the case
40
pF
d
S
,d
A
d
S
,d
A
pin - pin
pin - backside metal
1.7
5.5
mm
mm
Weight
9
g
Diodes
Symbol
Conditions
Maximum Ratings
I
F25
I
F90
T
C
= 25°C
T
C
= 90°C
30
15
A
A
Symbol
Conditions
Characteristic Values
min.
typ.
max.
V
F
I
F
= 20 A; T
VJ
= 25°C
T
VJ
= 125°C
2.3
1.6
2.7
V
V
I
RM
t
rr
I
F
= 15 A; di
/dt = -400 A/μs; T
VJ
= 125°C
V
R
= 300 V; V
GE
= 0 V
7
A
50
ns
R
thJC
R
thJH
(per diode)
with heat transfer paste
2.3 K/W
4.6
K/W
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| L532001051 | 制造商:Motorola Inc 功能描述: |
| L532C | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:THYRISTOR MODULE|BRIDGE|HALF-CNTLD|240V V(RRM)|27A I(T) |
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