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參數(shù)資料
| 型號： | L08056R8DEWTR |
| 廠商： | AVX CORP |
| 元件分類： | 通用定值電感 |
| 英文描述： | IND 6.8UH 0.5UH THIN-FILM SMD-0805 TR-7 NI/SN-PB RF |
| 中文描述： | 1 ELEMENT, 0.0068 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD |
| 封裝： | CHIP, 0805 |
| 文件頁數(shù)： | 5/5頁 |
| 文件大?。?/td> | 99K |
| 代理商： | L08056R8DEWTR |
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Accu-L 0805
Application Notes
HANDLING
SMD chips should be handled with care to avoid damage or
contamination from perspiration and skin oils. The use of
plastic tipped tweezers or vacuum pick-ups is strongly
recommended for individual components. Bulk handling
should ensure that abrasion and mechanical shock are min-
imized. For automatic equipment, taped and reeled product
is the ideal medium for direct presentation to the placement
machine.
CIRCUIT BOARD TYPE
All flexible types of circuit boards may be used (e.g. FR-4,
G-10) and also alumina.
For other circuit board materials, please consult factory.
COMPONENT PAD DESIGN
Component pads must be designed to achieve good joints
and minimize component movement during soldering.
Pad designs are given below for both wave and reflow
soldering.
The basis of these designs is:
a. Pad width equal to component width. It is permissible
to decrease this to as low as 85% of component width
but it is not advisable to go below this.
b. Pad overlap about 0.3mm.
c. Pad extension about 0.3mm for reflow.
Pad extension about 0.8mm for wave soldering.
PREHEAT & SOLDERING
The rate of preheat in production should not exceed
4°C/second. It is recommended not to exceed 2°C/
second.
Temperature differential from preheat to soldering should not
exceed 150°C.
For further specific application or process advice, please
consult AVX.
HAND SOLDERING & REWORK
Hand soldering is permissible. Preheat of the PCB to 100°C
is required. The most preferable technique is to use hot air
soldering tools. Where a soldering iron is used, a tempera-
ture controlled model not exceeding 30 watts should be
used and set to not more than 260°C. Maximum allowed
time at temperature is 1 minute. When hand soldering, the
base side (white side) must be soldered to the board.
COOLING
After soldering, the assembly should preferably be allowed to
cool naturally. In the event of assisted cooling, similar condi-
tions to those recommended for preheating should be used.
CLEANING RECOMMENDATIONS
Care should be taken to ensure that the devices are thor-
oughly cleaned of flux residues, especially the space beneath
the device. Such residues may otherwise become conduc-
tive and effectively offer a lossy bypass to the device. Various
recommended cleaning conditions (which must be optimized
for the flux system being used) are as follows:
Cleaning liquids . . . . . . i-propanol, ethanol, acetylace-
tone, water, and other standard
PCB cleaning liquids.
Ultrasonic conditions . . power – 20w/liter max.
frequency – 20kHz to 45kHz.
Temperature . . . . . . . . . 80°C maximum (if not otherwise
limited by chosen solvent system).
Time. . . . . . . . . . . . . . . 5 minutes max.
STORAGE CONDITIONS
Recommended storage conditions for Accu-L prior to use
are as follows:
Temperature. . . . . . . . . 15°C to 35°C
Humidity . . . . . . . . . . .
≤65%
Air Pressure . . . . . . . . . 860mbar to 1060mbar
RECOMMENDED SOLDERING
PROFILE
For recommended soldering profile see page 23
REFLOW SOLDERING
DIMENSIONS: millimeters (inches)
WAVE SOLDERING
DIMENSIONS: millimeters (inches)
1.2
(0.047)
1.2
(0.047)
1.4
(0.055)
3.8
(0.150)
1.5
(0.059)
0805
Accu-L
0.7
(0.028)
0.7
(0.028)
1.4
(0.055)
2.8
(0.110)
1.5
(0.059)
0805
Accu-L
1.30
(0.051)
1.30
(0.051)
0.50
(0.020)
3.1
(0.122)
0.8
(0.031)
0603
Accu-L
0.90
(0.035)
0.90
(0.035)
0.50
(0.020)
2.3
(0.091)
0.8
(0.031)
0603
Accu-L
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| L08058R2DESTR | INDUCTOR, 0805 CASE, 8.2NH; Inductor type:High Frequency / RF; Series:Accu-L; Inductance:8.2nH; Tolerance, inductance:+/-6.1%; Resistance:0.12R; Current, DC max:1500mA; Frequency, resonant:3500MHz; Case style:0805; Q factor:43; RoHS Compliant: Yes |
| L10452-04 | 808 nm, LASER DIODE |
| L14CX | MERMETIC SILICON PHOTOTRANSISTOR |
| L14G1 | PHOTO TRANSISTOR DETECTOR |
| L14N1 | PHOTO TRANSISTOR DETECTOR |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| L08056R8DEWTR\\500 | 制造商:AVX Corporation 功能描述:IND RF THNFLM ML 6.8NH 0.5NH 450MHZ 43Q-FCTR 1.5A 0805 - Tape and Reel 制造商:AVX Corporation 功能描述:AVX DESIGN WIN PART LOAD - Tape and Reel 制造商:AVX Corporation 功能描述:INDUCTOR THIN FILM 6.8NH 0805 |
| L08056R8DEWTR\\O | 制造商:AVX Corporation 功能描述:ACCU-L - Tape and Reel 制造商:AVX Corporation 功能描述:INDUCTOR THIN FILM 6.8NH 0805 |
| L08056R8DEWTR\500 | 功能描述:固定電感器 6.8nH 0805 SIZE RoHS:否 制造商:AVX 電感:10 uH 容差:20 % 最大直流電流:1 A 最大直流電阻:0.075 Ohms 工作溫度范圍:- 40 C to + 85 C 自諧振頻率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接類型:SMD/SMT 封裝 / 箱體:6.6 mm x 4.45 mm |
| L08056R8DEWTR\O | 功能描述:固定電感器 ACCU-L 0805 6.8nH RoHS:否 制造商:AVX 電感:10 uH 容差:20 % 最大直流電流:1 A 最大直流電阻:0.075 Ohms 工作溫度范圍:- 40 C to + 85 C 自諧振頻率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接類型:SMD/SMT 封裝 / 箱體:6.6 mm x 4.45 mm |
| L08058R2CESTR | 制造商:AVX Corporation 功能描述:0805,8.2NH, +/-.2NH,HI-Q,SMT,IND,TR,HAZMAT - Tape and Reel |
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