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參數(shù)資料
| 型號(hào)： | KMZ49 |
| 廠商： | NXP Semiconductors N.V. |
| 元件分類： | 振動(dòng)和傾斜傳感器 |
| 英文描述： | Magnetic field sensor |
| 封裝： | KMZ49<SOT96|<<<1<Always Pb-free,; |
| 文件頁數(shù)： | 9/13頁 |
| 文件大小： | 124K |
| 代理商： | KMZ49 |
KMZ49
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 1 — 31 October 2011
9 of 13
NXP Semiconductors
KMZ49
Magnetic field sensor
11.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
Figure 5
) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 7
and
8
Table 7.
Package thickness (mm)
Table 8.
Package thickness (mm)
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Figure 5
.
SnPb eutectic process (from J-STD-020C)
Package reflow temperature (
C)
Volume (mm
3
)
< 350
235
220
350
220
220
< 2.5
2.5
Lead-free process (from J-STD-020C)
Package reflow temperature (
C)
Volume (mm
3
)
< 350
260
260
250
350 to 2000
260
250
245
> 2000
260
245
245
< 1.6
1.6 to 2.5
> 2.5
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|---|---|
| KMZ49,118 | 功能描述:板機(jī)接口霍耳效應(yīng)/磁性傳感器 Magnetic field sensor RoHS:否 制造商:Honeywell 類型:Bipolar Hall-Effect Digital Position Sensor 工作電源電壓:3 V to 24 V 電源電流:3.5 mA 最大輸出電流:20 mA 工作點(diǎn)最小值/最大值:5 G, 55 G 最小/最大釋放點(diǎn)（Brp）:- 55 G, - 5 G 最大工作溫度:+ 150 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOT-23 |
| KMZ50 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Magnetic field sensor |
| KMZ51 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Magnetic field sensor |
| KMZ51,115 | 功能描述:板機(jī)接口霍耳效應(yīng)/磁性傳感器 MAGNETIC FIELD SENSR RoHS:否 制造商:Honeywell 類型:Bipolar Hall-Effect Digital Position Sensor 工作電源電壓:3 V to 24 V 電源電流:3.5 mA 最大輸出電流:20 mA 工作點(diǎn)最小值/最大值:5 G, 55 G 最小/最大釋放點(diǎn)（Brp）:- 55 G, - 5 G 最大工作溫度:+ 150 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOT-23 |
| KMZ52 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Magnetic Field Sensor |
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