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    參數(shù)資料
    

    


    


    
型號：
KMPC8347ZQAGD

    

    
廠商：
Freescale Semiconductor

    

    
文件頁數(shù)：
85/99頁

    

    
文件大?。?/td>
0K

    

    
描述：
IC MPU POWERQUICC II 620-PBGA

    

    
標準包裝：
2

    

    
系列：
MPC83xx

    

    
處理器類型：
32-位 MPC83xx PowerQUICC II Pro
    		

    

    
速度：
400MHz
    		

    

    
電壓：
1.2V
    		

    

    
安裝類型：
表面貼裝
    		

    

    
封裝/外殼：
620-BBGA 裸露焊盤
    		

    

    
供應商設備封裝：
620-PBGA（29x29）
    		

    

    
包裝：
托盤
    		

    

    

    

	
    
    
    

    
    
	
    MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
    86
    Freescale Semiconductor
    Thermal
    20.2.1
    Estimation of Junction Temperature with Junction-to-Ambient
    Thermal Resistance
    An estimation of the chip junction temperature, TJ, can be obtained from the equation:
    TJ = TA + (RθJA × PD)
    where:
    TJ = junction temperature (°C)
    TA = ambient temperature for the package (°C)
    RθJA = junction-to-ambient thermal resistance (°C/W)
    PD = power dissipation in the package (W)
    The junction-to-ambient thermal resistance is an industry-standard value that provides a quick and easy
    estimation of thermal performance. Generally, the value obtained on a single-layer board is appropriate for
    a tightly packed printed-circuit board. The value obtained on the board with the internal planes is usually
    appropriate if the board has low power dissipation and the components are well separated. Test cases have
    demonstrated that errors of a factor of two (in the quantity TJ –TA) are possible.
    20.2.2
    Estimation of Junction Temperature with Junction-to-Board
    Thermal Resistance
    The thermal performance of a device cannot be adequately predicted from the junction-to-ambient thermal
    resistance. The thermal performance of any component is strongly dependent on the power dissipation of
    surrounding components. In addition, the ambient temperature varies widely within the application. For
    many natural convection and especially closed box applications, the board temperature at the perimeter
    (edge) of the package is approximately the same as the local air temperature near the device. Specifying
    the local ambient conditions explicitly as the board temperature provides a more precise description of the
    local ambient conditions that determine the temperature of the device.
    At a known board temperature, the junction temperature is estimated using the following equation:
    TJ = TA + (RθJA × PD)
    where:
    TJ = junction temperature (°C)
    TA = ambient temperature for the package (°C)
    RθJA = junction-to-ambient thermal resistance (°C/W)
    PD = power dissipation in the package (W)
    When the heat loss from the package case to the air can be ignored, acceptable predictions of junction
    temperature can be made. The application board should be similar to the thermal test condition: the
    component is soldered to a board with internal planes.
    
    
    
    
    
    


    


    

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    相關代理商/技術參數(shù)
    		

    參數(shù)描述
    		

    
    

    
KMPC8347ZQAGDB
功能描述:微處理器 - MPU 8347 PBGA PB W/O ENC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324

    

    
KMPC8347ZUAGDB
功能描述:微處理器 - MPU 834X TBGA PB RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324

    

    
KMPC8347ZUAJDB
功能描述:微處理器 - MPU 8349 TBGA W/PB RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324

    

    
KMPC8347ZUAJF
功能描述:IC MPU PWRQUICC II 672-TBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC83xx 標準包裝:2 系列:MPC8xx 處理器類型:32-位 MPC8xx PowerQUICC 特點:- 速度:133MHz 電壓:3.3V 安裝類型:表面貼裝 封裝/外殼:357-BBGA 供應商設備封裝:357-PBGA（25x25） 包裝:托盤

    

    
KMPC8347ZUAJFB
功能描述:微處理器 - MPU 8349 TBGA W/PB RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324

    

    
    
    
    
	
    	
    
    
     
     
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