參數(shù)資料
型號(hào): KMPC8347VVAJF
廠商: Freescale Semiconductor
文件頁(yè)數(shù): 67/99頁(yè)
文件大?。?/td> 0K
描述: IC MPU PWRQUICC II 672-TBGA
標(biāo)準(zhǔn)包裝: 2
系列: MPC83xx
處理器類(lèi)型: 32-位 MPC83xx PowerQUICC II Pro
速度: 533MHz
電壓: 1.2V
安裝類(lèi)型: 表面貼裝
封裝/外殼: 672-LBGA
供應(yīng)商設(shè)備封裝: 672-TBGA(35x35)
包裝: 托盤(pán)
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
7
Electrical Characteristics
2.1.1
Absolute Maximum Ratings
Table 1 provides the absolute maximum ratings.
Table 1. Absolute Maximum Ratings1
Parameter
Symbol
Max Value
Unit
Notes
Core supply voltage
VDD
–0.3 to 1.32 (1.36 max
for 667-MHz core
frequency)
V—
PLL supply voltage
AVDD
–0.3 to 1.32 (1.36 max
for 667-MHz core
frequency)
V—
DDR and DDR2 DRAM I/O voltage
GVDD
–0.3 to 2.75
–0.3 to 1.98
V—
Three-speed Ethernet I/O, MII management voltage
LVDD
–0.3 to 3.63
V
PCI, local bus, DUART, system control and power management, I2C,
and JTAG I/O voltage
OVDD
–0.3 to 3.63
V
Input voltage
DDR DRAM signals
MVIN
–0.3 to (GVDD + 0.3)
V
2, 5
DDR DRAM reference
MVREF
–0.3 to (GVDD + 0.3)
V
2, 5
Three-speed Ethernet signals
LVIN
–0.3 to (LVDD + 0.3)
V
4, 5
Local bus, DUART, CLKIN, system control and
power management, I2C, and JTAG signals
OVIN
–0.3 to (OVDD + 0.3)
V
3, 5
PCI
OVIN
–0.3 to (OVDD + 0.3)
V
6
Storage temperature range
TSTG
–55 to 150
°C—
Notes:
1 Functional and tested operating conditions are given in Table 2. Absolute maximum ratings are stress ratings only, and
functional operation at the maximums is not guaranteed. Stresses beyond those listed may affect device reliability or cause
permanent damage to the device.
2 Caution: MV
IN must not exceed GVDD by more than 0.3 V. This limit can be exceeded for a maximum of 20 ms during
power-on reset and power-down sequences.
3 Caution: OV
IN must not exceed OVDD by more than 0.3 V. This limit can be exceeded for a maximum of 20 ms during
power-on reset and power-down sequences.
4 Caution: LV
IN must not exceed LVDD by more than 0.3 V. This limit can be exceeded for a maximum of 20 ms during power-on
reset and power-down sequences.
5 (M,L,O)V
IN and MVREF may overshoot/undershoot to a voltage and for a maximum duration as shown in Figure 2.
6 OVIN on the PCI interface can overshoot/undershoot according to the PCI Electrical Specification for 3.3-V operation, as
shown in Figure 3.
相關(guān)PDF資料
PDF描述
HSC49DTES CONN EDGECARD 98POS .100 EYELET
HMC49DTES CONN EDGECARD 98POS .100 EYELET
KMPC8347VRAGD IC MPU POWERQUICC II 620-PBGA
EMC50DTEN CONN EDGECARD 100POS .100 EYELET
EMC50DTEH CONN EDGECARD 100POS .100 EYELET
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
KMPC8347VVAJFB 功能描述:微處理器 - MPU 8349 TBGA NOPB RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
KMPC8347VVALFB 功能描述:微處理器 - MPU 8349 TBGA NOPB RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
KMPC8347ZQAGD 功能描述:IC MPU POWERQUICC II 620-PBGA RoHS:否 類(lèi)別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC83xx 標(biāo)準(zhǔn)包裝:2 系列:MPC8xx 處理器類(lèi)型:32-位 MPC8xx PowerQUICC 特點(diǎn):- 速度:133MHz 電壓:3.3V 安裝類(lèi)型:表面貼裝 封裝/外殼:357-BBGA 供應(yīng)商設(shè)備封裝:357-PBGA(25x25) 包裝:托盤(pán)
KMPC8347ZQAGDB 功能描述:微處理器 - MPU 8347 PBGA PB W/O ENC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
KMPC8347ZUAGDB 功能描述:微處理器 - MPU 834X TBGA PB RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324