參數(shù)資料
型號(hào)： KMPC8241LZQ266D
廠商： Freescale Semiconductor
文件頁(yè)數(shù)： 49/58頁(yè)
文件大?。?/td> 0K
描述： IC MPU 32BIT 266MHZ 357-PBGA
標(biāo)準(zhǔn)包裝： 2
系列： MPC82xx
處理器類(lèi)型： 32-位 MPC82xx PowerQUICC II
速度： 266MHz
電壓： 1.8V
安裝類(lèi)型： 表面貼裝
封裝/外殼： 357-BBGA
供應(yīng)商設(shè)備封裝： 357-PBGA（25x25）
包裝： 托盤(pán)
MPC8241 Integrated Processor Hardware Specifications, Rev. 10
Freescale Semiconductor
53
Ordering Information
8.1
Part Numbers Fully Addressed by This Document
Table 19 provides the Freescale part numbering nomenclature for the MPC8241. Note that the individual
part numbers correspond to a maximum processor core frequency. For available frequencies, contact your
local Freescale sales office. In addition to the processor frequency, the part numbering scheme also
includes an application modifier that may specify special application conditions. Each part number also
contains a revision code that refers to the die mask revision number. Read the Revision ID register at
address offset 0x08 to determine the revision level.
8.2
Part Numbers Not Fully Addressed by This Document
Parts with application modifiers or revision levels not fully addressed in this specification document are
described in separate hardware specifications addendums that supplement and supersede this document
Table 19. Part Numbering Nomenclature
MPC
nnnn
L
xx
nnn
x
Product
Code
Part
Identifier
Process Descriptor
Package 1
Processor
Frequency 2
(MHz)
Revision
Level
MPC
8241
L = Standard spec.
0
° to 105°C
ZQ = thick substrate and thick
mold cap PBGA (two layers)
166, 200
1.8 V ± 100 mV
D:1.4 = Rev.
ID:0x14
ZQ = thick substrate and thick
mold cap PBGA (four layers,
thermally enhanced)
266
1.8 V ± 100 mV
VR = Lead-free version of package
166, 200, 266
1.8 V ± 100 mV
Notes:
1. See Section 5, “Package Description,” for more information on available package types.
2. Processor core frequencies supported by parts addressed by this specification only. Not all parts described in this
specification support all core frequencies. Additionally, parts addressed by hardware specifications addendums may support
other maximum core frequencies.
Table 20. Part Numbers Addressed by MPC8241TXXPNS Series
(Document No. MPC8241ECSO1AD))
MPC
nnnn
T
xx
nnn
x
Product
Code
Part
Identifier
Process Descriptor
Package 1
Processor
Frequency 2
(MHz)
Revision
Level
Processor
Version
Register
Value
相關(guān)PDF資料
PDF描述
KMPC8241LZQ200D IC MPU 32BIT 200MHZ 357-PBGA
KMPC8241LZQ166D IC MPU 32BIT 166MHZ 357-PBGA
KMPC8241LVR266D IC MPU 32BIT 266MHZ 357-PBGA
IDT7054L35PRF IC SRAM 32KBIT 35NS 128TQFP
IDT7142SA55C IC SRAM 16KBIT 55NS 48DIP
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
KMPC8241TVR166D 功能描述:微處理器 - MPU INTEGRATED HOST PROC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
KMPC8241TVR200D 功能描述:微處理器 - MPU INTEGRATED HOST PROC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
KMPC8241TZQ166D 功能描述:微處理器 - MPU INTEGRATED HOST PROC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
KMPC8241TZQ200D 功能描述:微處理器 - MPU INTEGRATED HOST PROC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
KMPC8245ARVV400D 功能描述:微處理器 - MPU INTEGRATED HOST PROC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫(xiě)一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*