參數(shù)資料
型號: KMC850DSLCZQ50BU
廠商: Freescale Semiconductor
文件頁數(shù): 71/72頁
文件大小: 0K
描述: IC MPU QUICC CPM 50MHZ 256-PBGA
標準包裝: 2
系列: MPC8xx
處理器類型: 32-位 MPC8xx PowerQUICC
速度: 50MHz
電壓: 3.3V
安裝類型: 表面貼裝
封裝/外殼: 256-BGA
供應(yīng)商設(shè)備封裝: 256-PBGA(23x23)
包裝: 托盤
MPC850 PowerQUICC Integrated Communications Processor Hardware Specifications, Rev. 2
8
Freescale Semiconductor
Thermal Characteristics
4
Thermal Characteristics
Table 3 shows the thermal characteristics for the MPC850.
Table 4 provides power dissipation information.
Table 5 provides the DC electrical characteristics for the MPC850.
Table 3. Thermal Characteristics
Characteristic
Symbol
Value
Unit
Thermal resistance for BGA 1
1
For more information on the design of thermal vias on multilayer boards and BGA layout considerations in
general, refer to AN-1231/D, Plastic Ball Grid Array Application Note available from your local Freescale sales
office.
θJA
40 2
2 Assumes natural convection and a single layer board (no thermal vias).
°C/W
θJA
31 3
3
Assumes natural convection, a multilayer board with thermal vias4, 1 watt MPC850 dissipation, and a board
temperature rise of 20
°C above ambient.
°C/W
θJA
24 4
4 Assumes natural convection, a multilayer board with thermal vias4, 1 watt MPC850 dissipation, and a board
temperature rise of 13
°C above ambient.
TJ = TA + (PD
θJA)
PD = (VDD
IDD) + PI/O
where:
PI/O is the power dissipation on pins
°C/W
Thermal Resistance for BGA (junction-to-case)
θJC
8
°C/W
Table 4. Power Dissipation (PD)
Characteristic
Frequency (MHz)
Typical 1
1
Typical power dissipation is measured at 3.3V
Maximum 2
2
Maximum power dissipation is measured at 3.65 V
Unit
Power Dissipation
All Revisions
(1:1) Mode
33
TBD
515
mW
40
TBD
590
mW
50
TBD
725
mW
Table 5. DC Electrical Specifications
Characteristic
Symbol
Min
Max
Unit
Operating voltage at 40 MHz or less
VDDH, VDDL,
KAPWR, VDDSYN
3.0
3.6
V
Operating voltage at 40 MHz or higher
VDDH, VDDL,
KAPWR, VDDSYN
3.135
3.465
V
Input high voltage (address bus, data bus, EXTAL, EXTCLK,
and all bus control/status signals)
VIH
2.0
3.6
V
Input high voltage (all general purpose I/O and peripheral pins)
VIH
2.0
5.5
V
相關(guān)PDF資料
PDF描述
KMC7457VG1267LC IC MPU RISC 32BIT 1267MHZ 483BGA
65801-041LF CLINCHER RECEPTACLE 12POS GOLD
65801-039LF CLINCHER RECEPTACLE 10POS GOLD
KMPC8248VRTMFA IC MPU PWRQUICC II 516-PBGA
IDT70V9279S7PRF IC SRAM 512KBIT 7NS 128TQFP
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
KMC8610VT1066JB 功能描述:微處理器 - MPU REV 1.1 8610 1.0V 105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
KMC8610VT1333JB 功能描述:微處理器 - MPU REV 1.1 8610 1.025V 105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
KMC8640DHX1250HC 功能描述:微處理器 - MPU G8, REV2.1, 1.05V 105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
KMC8641DHX1333JC 功能描述:微處理器 - MPU G8, REV2.1, 1.05V 105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
KMC8641DHX1500KC 功能描述:微處理器 - MPU G8, REV2.1, 1.1V 105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324