MAXIMUM RATINGS ARCHIVE INFORMATION ARCHIVE IN" />
參數(shù)資料
型號(hào)： KIT33993DWBEVB
廠商： Freescale Semiconductor
文件頁(yè)數(shù)： 23/28頁(yè)
文件大?。?/td> 0K
描述： KIT EVAL FOR MC33993 SWITCH DET
標(biāo)準(zhǔn)包裝： 1
類型： 微控制器
適用于相關(guān)產(chǎn)品： MC33993
所含物品： 評(píng)估板、數(shù)據(jù)表和說明文檔
Analog Integrated Circuit Device Data
4
Freescale Semiconductor
33993
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ARCHIVE
INFORMATION
ARCHIVE
INFORMATION
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
ELECTRICAL RATINGS
VDD Supply Voltage
–
-0.3 to 7.0
VDC
CS,
SI, SO, SCLK, INT, AMUX (1)
–
-0.3 to 7.0
VDC
WAKE (1)
–
-0.3 to 40
VDC
VPWR Supply Voltage
–
-0.3 to 50
VDC
Switch Input Voltage Range
–
-14 to 40
VDC
Frequency of SPI Operation (VDD = 5.0 V)
–
6.0
MHz
ESD Voltage (2)
Human Body Model
Machine Model
VESD1
VESD2
±4000
±200
V
THERMAL RATINGS
Storage Temperature
TSTG
-55 to 150
°C
Operating Case Temperature
TC
-40 to 125
°C
Operating Junction Temperature
TJ
-40 to 150
°C
THERMAL RESISTANCE
Power Dissipation (TA = 25°C) (3)
PD
1.7
W
Thermal Resistance
Junction to Ambient
Junction to Lead
RθJA
RθJL
74
25
°C/W
Peak Package Reflow Temperature During Reflow (4), (5)
TPPRT
°C
Notes
1.
Exceeding these limits may cause malfunction or permanent damage to the device.
2.
ESD testing is performed in accordance with the Human Body Model (HBM) (CZAP = 100 pF, RZAP = 1500 Ω), the Machine Model (MM)
(CZAP = 200 pF, RZAP = 0 Ω), and the Charge Device Model (CDM), Robotic (CZAP = 4.0pF).
3.
Maximum power dissipation at TJ =150°C junction temperature with no heat sink used.
4.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
5.
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