參數(shù)資料
型號: K7A403609B-QC
廠商: SAMSUNG SEMICONDUCTOR CO. LTD.
英文描述: 128Kx36/x32 & 256Kx18 Synchronous SRAM
中文描述: 128Kx36/x32
文件頁數(shù): 3/18頁
文件大?。?/td> 470K
代理商: K7A403609B-QC
K7A401800B
128Kx36/x32 & 256Kx18 Synchronous SRAM
- 3 -
Rev 1.0
Nov 2001
K7A403200B
K7A403600B
128Kx36 & 128Kx32 & 256Kx18-Bit Synchronous Pipelined Burst SRAM
The K7A403600B, K7A403200B and K7A401800B are
4,718,592-bit Synchronous Static Random Access Memory
designed for high performance second level cache of Pen-
tium and Power PC based System.
It is organized as 128K(256K) words of 36(18) bits and inte-
grates address and control registers, a 2-bit burst address
counter and added some new functions for high perfor-
mance cache RAM applications; GW, BW, LBO, ZZ. Write
cycles are internally self-timed and synchronous.
Full bus-width write is done by GW, and each byte write is
performed by the combination of WEx and BW when GW is
high. And with CS
1
high, ADSP is blocked to control signals.
Burst cycle can be initiated with either the address status
processor(ADSP) or address status cache controller(ADSC)
inputs. Subsequent burst addresses are generated inter-
nally in the system
s burst sequence and are controlled by
the burst address advance(ADV) input.
LBO pin is DC operated and determines burst sequence(lin-
ear or interleaved).
ZZ pin controls Power Down State and reduces Stand-by
current regardless of CLK.
The K7A403600B, K7A403200B and K7A401800B are fab-
ricated using SAMSUNG
s high performance CMOS tech-
nology and is available in a 100pin TQFP package. Multiple
power and ground pins are utilized to minimize ground
bounce.
GENERAL DESCRIPTION
FEATURES
Synchronous Operation.
2 Stage Pipelined operation with 4 Burst.
On-Chip Address Counter.
Self-Timed Write Cycle.
On-Chip Address and Control Registers.
V
DD
= 3.3V+0.3V/-0.165V Power Supply.
V
DDQ
Supply Voltage 3.3V+0.3V/-0.165V for 3.3V I/O
or 2.5V+0.4V/-0.125V for 2.5V I/O.
5V Tolerant Inputs Except I/O Pins.
Byte Writable Function.
Global Write Enable Controls a full bus-width write.
Power Down State via ZZ Signal.
LBO Pin allows a choice of either a interleaved burst or a linear
burst.
Three Chip Enables for simple depth expansion with No Data Cont-
nention ; 2cycle Enable, 1cycle Disable.
Asynchronous Output Enable Control.
ADSP, ADSC, ADV Burst Control Pins.
TTL-Level Three-State Output.
100-TQFP-1420A .
Operating in commeical and industrial temperature range.
LOGIC BLOCK DIAGRAM
CLK
LBO
ADV
ADSC
ADSP
CS1
CS2
CS2
GW
BW
WEx
(x=a,b,c,d or a,b)
OE
ZZ
DQa0 ~ DQd7
DQPa ~ DQPd
BURST CONTROL
LOGIC
BURST
ADDRESS
COUNTER
128Kx36/32 , 256Kx18
MEMORY
ARRAY
ADDRESS
REGISTER
CONTROL
LOGIC
OUTPUT
REGISTER
DATA-IN
REGISTER
BUFFER
C
R
C
R
A
0~A
1
A0~A1
or A2~A17
A0~A16
or A0~A17
A2~A16
or DQa0 ~ DQb7
DQPa ~ DQPb
36/32 or 18
FAST ACCESS TIMES
PARAMETER
Symbol
-16
-14
Unit
Cycle Time
tCYC
6.0
7.2
ns
Clock Access Time
tCD
3.5
4.0
ns
Output Enable Access Time
tOE
3.5
4.0
ns
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