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參數(shù)資料
| 型號(hào)： | K4S643232C-TC55 |
| 廠商： | SAMSUNG SEMICONDUCTOR CO. LTD. |
| 英文描述： | Low Noise Precision Advanced LinCMOS(TM) Single Operational Amplifier 8-CDIP -55 to 125 |
| 中文描述： | 200萬× 32內(nèi)存為512k × 32 × 4銀行同步DRAM LVTTL |
| 文件頁數(shù)： | 20/43頁 |
| 文件大?。?/td> | 1155K |
| 代理商： | K4S643232C-TC55 |
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K4S643232C
CMOS SDRAM
REV. 1.1 Nov. '99
- 20
*Note :
1. Active power down : one or more banks active state.
2. Precharge power down : all banks precharge state.
3. The auto refresh is the same as CBR refresh of conventional DRAM.
No precharge commands are required after auto refresh command.
During t
RFC
from auto refresh command, any other command can not be accepted.
4. Before executing auto/self refresh command, all banks must be idle state.
5. MRS, Bank Active, Auto/Self Refresh, Power Down Mode Entry.
6. During self refresh mode, refresh interval and refresh operation are perfomed internally.
After self refresh entry, self refresh mode is kept while CKE is low.
During self refresh mode, all inputs expect CKE will be don't cared, and outputs will be in Hi-Z state.
For the time interval of t
RFC
from self refresh exit command, any other command can not be accepted.
Before/After self refresh mode, burst auto refresh cycle (4096 cycles) is recommended.
10. Clock Suspend Exit & Power Down Exit
CLK
CKE
CMD
RD
1) Clock Suspend (=Active Power Down) Exit
tSS
CLK
CKE
CMD
2) Power Down (=Precharge Power Down) Exit
Note 1
Note 5
Internal
CLK
NOP
tSS
Note 2
Internal
CLK
11. Auto Refresh & Self Refresh
CLK
CMD
1) Auto Refresh & Self Refresh
CKE
PRE
AR
CMD
Note 4
tRP
tRFC
ó
ó
ó
ó
CLK
CMD
2) Self Refresh
CKE
PRE
SR
CMD
Note 4
tRP
tRFC
ó
Note 6
Note 3
ACT
ó
ó
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| K4S643232C-TC60 | Low Noise Precision Advanced LinCMOS(TM) Single Operational Amplifier 20-LCCC -55 to 125 |
| K4S643232C-TC70 | Low Noise Precision Advanced LinCMOS(TM) Single Operational Amplifier 8-CDIP -55 to 125 |
| K4S643232E | 2M x 32 SDRAM 512K x 32bit x 4 Banks Synchronous DRAM LVTTL |
| K4S643232E-TE70 | 2M x 32 SDRAM 512K x 32bit x 4 Banks Synchronous DRAM LVTTL(3.3V) |
| K4S643232E-TC45 | 2M x 32 SDRAM 512K x 32bit x 4 Banks Synchronous DRAM LVTTL |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| K4S643232C-TC60 | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:2M x 32 SDRAM 512K x 32bit x 4 Banks Synchronous DRAM LVTTL |
| K4S643232CTC70 | 制造商:Samsung Semiconductor 功能描述: |
| K4S643232C-TC70 | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:2M x 32 SDRAM 512K x 32bit x 4 Banks Synchronous DRAM LVTTL |
| K4S643232C-TC70000 | 制造商:Samsung SDI 功能描述:DRAM Chip SDRAM 64M-Bit 2Mx32 3.3V 86-Pin TSOP-II Tray |
| K4S643232C-TC80 | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:2M x 32 SDRAM 512K x 32bit x 4 Banks Synchronous DRAM LVTTL |
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