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參數(shù)資料
| 型號： | K4S640832H-UC75 |
| 廠商： | SAMSUNG SEMICONDUCTOR CO. LTD. |
| 英文描述： | D-Subminiature Connector; Gender:Female; No. of Contacts:50; Contact Termination:IDC; D Sub Shell Size:DB50; Body Material:Steel; Contact Plating:Gold Over Nickel RoHS Compliant: Yes |
| 中文描述： | 64兆?芯片與內(nèi)存規(guī)格鉛54 TSOP-II免費（符合RoHS） |
| 文件頁數(shù)： | 2/14頁 |
| 文件大小： | 144K |
| 代理商： | K4S640832H-UC75 |
SDRAM 64Mb H-die (x4, x8, x16)
CMOS SDRAM
Rev. 1.8 August 2004
Revision History
Revision 0.0 (May, 2003)
- Target spec release
Revision 0.1 (July, 2003)
- Preliminary spec release
Revision 0.2 (August, 2003)
- Modified IBIS characteristic.
Revision 1.0 (September, 2003)
- Finalized.
Revision 1.1 (September, 2003)
- Corrected IBIS Specification.
Revision 1.2 (October, 2003)
- Deleted speed 7C at x4/x8.
Revision 1.3 (October, 2003)
- Deleted AC parameter notes 5.
Revision 1.4 (November, 2003)
- Modified Pin Function description.
Revision 1.5 (February, 2004)
- Corrected typo.
Revision 1.6 (March, 2004)
- Modified Pin Description.
Revision 1.7 (May, 2004)
- Added Note 5. sentense of tRDL parameter.
Revision 1.8 (August, 2004)
- Modified CLK cycle time(tcc) parameter in AC Characteristics.
( If you want use of CL=2 not CL=3, the maximum operating frequency is 100MHz regardless of its speed bin.)
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| K4S640432H-UC75 | D-Subminiature Connector; Gender:Female; No. of Contacts:50; Contact Termination:IDC; D Sub Shell Size:DB50; Body Material:Steel; Contact Plating:Gold Over Nickel RoHS Compliant: Yes |
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