參數(shù)資料
型號: K4H511638D-UCC
廠商: SAMSUNG SEMICONDUCTOR CO. LTD.
英文描述: 512Mb D-die DDR SDRAM Specification 66 TSOP-II with Pb-Free (RoHS compliant)
中文描述: ?的512Mb芯片與DDR SDRAM的規(guī)格鉛66 TSOP-II免費(符合RoHS)
文件頁數(shù): 15/24頁
文件大?。?/td> 366K
代理商: K4H511638D-UCC
Rev. 0.3 June. 2005
DDR SDRAM
DDR SDRAM 512Mb D-die (x8, x16)
Preliminary
Parameter
Specification
DDR400
DDR333
DDR200/266
Maximum peak amplitude allowed for overshoot
TBD
TBD
1.2 V
Maximum peak amplitude allowed for undershoot
TBD
TBD
1.2 V
The area between the overshoot signal and VDD must be less than or equal to
TBD
TBD
2.4 V-ns
The area between the undershoot signal and GND must be less than or equal to
TBD
TBD
2.4 V-ns
5
4
3
2
1
0
-1
-2
-3
-4
-5
0
0.5 1.0 1.42 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 5.68 6.0 6.5 7.0
VDDQ
Overshoot
Maximum Amplitude = 1.2V
Area = 2.4V-ns
Maximum Amplitude = 1.2V
undershoot
GND
V
Tims(ns)
DQ/DM/DQS AC overshoot/Undershoot Definition
18.0 Overshoot/Undershoot specification for Data, Strobe and Mask Pins
相關(guān)PDF資料
PDF描述
K4H510838C-UC 512Mb C-die DDR SDRAM Specification
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K4H510838C-ZLB3 Connector Kit; Contents Of Kit:C14610G0245008 24 position hood PG 21 double latch high profile side entry, C14610A0241021 24 position male insert wire protect, VN162100014 PG 21 gland bushing, For 0.433" - 0.866" diameter cable RoHS Compliant: Yes
K4H510838C-ZCCC 512Mb C-die DDR SDRAM Specification
K4H510838C-ZCB3 512Mb C-die DDR SDRAM Specification
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