參數(shù)資料
型號: K4H2G0638A-UC
廠商: SAMSUNG SEMICONDUCTOR CO. LTD.
英文描述: Stacked 2Gb A-die SDRAM Specification
中文描述: 堆疊的2Gb阿模內(nèi)存規(guī)格
文件頁數(shù): 2/23頁
文件大?。?/td> 357K
代理商: K4H2G0638A-UC
Rev. 0.0 June. 2005
DDR SDRAM stacked 2Gb A-die (x4)
DDR SDRAM
Preliminary
Table of Contents
1.0 Key Features .............................................................................................................................. 4
2.0 Ordering Information ................................................................................................................ 4
3.0 Operating Frequencies............................................................................................................... 4
4.0 Pin Description .......................................................................................................................... 5
5.0 Package Physical Dimension ................................................................................................... 6
6.0 Block Diagram (st. 512Mbit x4 I/O x4 Banks)........................................................................... 6
7.0 Input/Output Function Description ........................................................................................... 7
8.0 Command Truth Table ............................................................................................................... 8
9.0 General Description.....................................................................................................................9
10.0 Absolute Maximum Rating .......................................................................................................9
11.0 DC Operating Conditions..........................................................................................................9
12.0 DDR SDRAM Spec Items & Test Conditions.........................................................................10
13.0 Input/Output Capacitance ......................................................................................................10
14.0 Detailed test condition for DDR SDRAM IDD1 & IDD7A ......................................................11
15.0 DDR SDRAM IDD spec table ..................................................................................................12
15.1 Current Calculation table
....................................................................................................... 12
16.0 AC Operating Conditions .......................................................................................................13
17.0 AC Overshoot/Undershoot specification for Address and Control Pins ...........................13
18.0 Overshoot/Undershoot specification for Data, Strobe and Mask Pins...............................14
19.0 AC Timming Parameters & Specifications ...........................................................................15
20.0 System Characteristics for DDR SDRAM ............................................................................. 16
21.0 Component Notes................................................................................................................... 17
22.0 System Notes ..........................................................................................................................19
23.0 IBIS : I/V Characteristics for Input and Output Buffers........................................................20
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