參數(shù)資料
型號: K4H280438F
廠商: SAMSUNG SEMICONDUCTOR CO. LTD.
英文描述: 128Mb F-die DDR SDRAM Specification
中文描述: 128Mb的的F - DDR SDRAM內(nèi)存芯片規(guī)格
文件頁數(shù): 13/23頁
文件大?。?/td> 206K
代理商: K4H280438F
DDR SDRAM
DDR SDRAM 128Mb F-die (x4, x8)
Rev. 1.1 May. 2004
AC Operating Conditions
Parameter/Condition
Symbol
VIH(AC)
VIL(AC)
VID(AC)
VIX(AC)
Min
Max-10
Unit
V
V
V
V
Note
Input High (Logic 1) Voltage, DQ, DQS and DM signals
Input Low (Logic 0) Voltage, DQ, DQS and DM signals.
Input Differential Voltage, CK and /CK inputs
Input Crossing Point Voltage, CK and /CK inputs
VREF + 0.31
VREF - 0.31
VDDQ+0.6
0.5*VDDQ+0.2
0.7
1
2
0.5*VDDQ-0.2
AC
Overshoot/Undershoot specification for Address and Control Pins
Parameter
Specification
DDR333
TBD
TBD
TBD
TBD
DDR266
1.5 V
1.5 V
4.5 V-ns
4.5 V-ns
Maximum peak amplitude allowed for overshoot
Maximum peak amplitude allowed for undershoot
The area between the overshoot signal and VDD must be less than or equal to
The area between the undershoot signal and GND must be less than or equal to
5
4
3
2
1
0
-1
-2
-3
-4
-5
0
0.5
0.6875
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.3125
6.5
7.0
VDD
Overshoot
Maximum Amplitude = 1.5V
Area = 4.5V-ns
Maximum Amplitude = 1.5V
undershoot
GND
V
Tims(ns)
AC overshoot/Undershoot Definition
Notes :
1. VID is the magnitude of the difference between the input level on CK and the input level on /CK.
2. The value of VIX is expected to equal 0.5*VDDQ of the transmitting device and must track variations in the dc level of the same.
相關(guān)PDF資料
PDF描述
K4H2G0638A-UC Stacked 2Gb A-die SDRAM Specification
K4H510438C-LA2 512Mb C-die DDR SDRAM Specification
K4H510438C-LB0 512Mb C-die DDR SDRAM Specification
K4H510438C-LB3 512Mb C-die DDR SDRAM Specification
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