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參數(shù)資料
| 型號： | ITF87052SVT |
| 廠商： | INTERSIL CORP |
| 元件分類： | 功率晶體管 |
| 英文描述： | 3A, 20V, 0.115 Ohm, P-Channel,2.5V Specified Power MOSFET(3A, 20V, 0.115Ω P溝道2.5V專用功率MOS場效應管) |
| 中文描述： | 3 A, 20 V, 0.19 ohm, P-CHANNEL, Si, POWER, MOSFET, MO-193AA |
| 封裝： | PLASTIC, TSOP-6 |
| 文件頁數(shù)： | 7/12頁 |
| 文件大小： | 188K |
| 代理商： | ITF87052SVT |
7
necessary information for calculation of the steady state
junction temperature or power dissipation. Pulse
applications can be evaluated using the Intersil device Spice
thermal model or manually utilizing the normalized maximum
transient thermal impedance curve.
Displayed on the curve are R
θ
JA
values listed in the Electrical
Specifications table. The points were chosen to depict the
compromise between the copper board area, the thermal
resistance and ultimately the power dissipation, P
DM
.
Thermal resistances corresponding to other copper areas can
be obtained from Figure 20 or by calculation using Equation 2.
R
θ
JA
is defined as the natural log of the area times a coefficient
added to a constant. The area, in square inches is the top
copper area including the gate and source pads.
The transient thermal impedance (Z
θ
JA
) is also affected by
varied top copper board area. Figure 21 shows the effect of
copper pad area on single pulse transient thermal
impedance. Each trace represents a copper pad area in
square inches corresponding to the descending list in the
graph. Spice and SABER thermal models are provided for
each of the listed pad areas.
Copper pad area has no perceivable effect on transient
thermal impedance for pulse widths less than 100ms. For
pulse widths less than 100ms the transient thermal
impedance is determined by the die and package. Therefore,
CTHERM1 through CTHERM5 and RTHERM1 through
RTHERM5 remain constant for each of the thermal models. A
listing of the model component values is available in Table 1.
(EQ. 2)
R
θ
JA
120.6
18.9
Area
(
)
ln
×
–
=
FIGURE 20. THERMAL RESISTANCE vs MOUNTING PAD
AREA
160
200
220
0.1
1.0
120
0.01
R
θ
JA
= 120.6 - 18.9*
ln
(AREA)
164.0
o
C/W - 0.1in
2
194.4
o
C/W - 0.02in
2
θ
J
(
o
C
AREA, TOP COPPER AREA (in
2
)
180
140
FIGURE 21. THERMAL IMPEDANCE vs MOUNTING PAD AREA
40
80
120
160
200
0
10
-1
10
0
10
1
10
2
10
3
t, RECTANGULAR PULSE DURATION (s)
Z
θ
J
,
COPPER BOARD AREA - DESCENDING ORDER
0.02 in
0.05 in
2
0.10 in
2
0.25 in
2
0.40 in
2
I
o
C
ITF87052SVT
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