參數(shù)資料
型號： ISP1520
廠商： NXP Semiconductors N.V.
英文描述： Hi-Speed Universal Serial Bus hub controller
中文描述： 高速通用串行總線控制器樞紐
文件頁數(shù)： 49/51頁
文件大小： 259K
代理商： ISP1520
Philips Semiconductors
ISP1520
Hi-Speed USB hub controller
Product data
Rev. 02 — 04 May 2004
49 of 51
9397 750 11689
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
[3]
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reflow
soldering with peak temperature exceeding 217
°
C
±
10
°
C measured in the atmosphere of the reflow
oven. The package body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSOP packages with a pitch (e) equal to or
larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than
0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex
foil by using a hot bar soldering process. The appropriate soldering profile can be provided on
request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
[4]
[5]
[6]
[7]
[8]
[9]
21. Revision history
Table 48:
Rev
02
Revision history
CPCN
20040504
Date
Description
Product data (9397 750 11689)
Modifications:
Removed information on bus-power and hybrid-power
Changed active LOW pin symbol representation from overscore (for example, NAME) to
underscore N (NAME_N)
Globally changed V
CC(5V0)
to V
REF(5V0)
Table 2
: updated
Updated
Section 9.1.3
Updated
Table 7
Table 34
and
Table 35
: changed the value of V
REF(5V0)
Globally changed the value of T
amb
Table 36
: removed I
CC(5V0)
Updated
Figure 16
Updated
Figure 19
and
Figure 20
.
Preliminary data (9397 750 10689)
-
01
20030625
-
相關(guān)PDF資料
PDF描述
ISP1520BD Hi-Speed Universal Serial Bus hub controller
ISP1521 Hi-Speed Universal Serial Bus hub controller
ISP1521BE Hi-Speed Universal Serial Bus hub controller
ISP1561 ISP1561BM
ISP1561BM ISP1561BM
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ISP1520BD 功能描述:IC USB HUB CONTROLLER HS 64-LQFP RoHS:是 類別:集成電路 (IC) >> 接口 - 專用 系列:- 標(biāo)準(zhǔn)包裝:3,000 系列:- 應(yīng)用:PDA，便攜式音頻/視頻，智能電話 接口:I²C，2 線串口 電源電壓:1.65 V ~ 3.6 V 封裝/外殼:24-WQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:24-QFN 裸露焊盤（4x4） 包裝:帶卷 (TR) 安裝類型:表面貼裝 產(chǎn)品目錄頁面:1015 (CN2011-ZH PDF) 其它名稱:296-25223-2
ISP1520BD,518 功能描述:USB 接口集成電路 USB2 4 PORT HUB RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20
ISP1520BD,551 功能描述:USB 接口集成電路 USB2 4-PORT HUB CTRLR RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20
ISP1520BD,557 功能描述:USB 接口集成電路 DO NOT USE ORDER -S OR -T PART RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20
ISP1520BD518 制造商:ST-Ericsson 功能描述:IC CONTROLLER USB HUB 64-LQFP
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